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TDA1314 데이터시트(PDF) 12 Page - NXP Semiconductors |
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TDA1314 데이터시트(HTML) 12 Page - NXP Semiconductors |
12 / 15 page August 1994 13 Philips Semiconductors Product specification Quadruple filter DAC TDA1314T APPLICATION INFORMATION The application diagram is illustrated in Fig.6. All pins used for testing (pins 1, 2, 23, 27 and 28 need not to be connected due to internal resistors being connected to ground or being used as test outputs. In the normal free-running mode it is also not required to connect pin 3. Jitter on the clock edges of MCLK must be as low as possible so as not to deteriorate the DAC THD performance. The jitter time must not be greater than 30 ns. Vref is the voltage reference pin with an internal resistor divider. A capacitor of 22 µF is used to get the specified power ripple rejection ratio. The output operational amplifiers are current-to-voltage converters by means of the 3 kW resistors connected between the DAC current outputs (pins 10, 12, 17 and 19) and the voltage outputs (pins 11, 13, 18 and 20) respectively. The voltage on the DAC current outputs is equal to the operational amplifiers virtual ground at Vref in the event that the operational amplifier is used according to the application diagram of Fig.6. Care should be taken, in order to reduce the electromagnetic compatibility (EMC) that the bandwidth of the digital signals being applied to pins MCLK, WS, SCK, SDF and SDR is not larger than necessary. This can be achieved by controlling the slew rate of the digital source outputs or connecting a series resistor close to the digital source output of the driving circuits. The resistor connected between Rref (pin 14) and ground is the current reference of the DACs. The voltage on Rref is equal to Vref. On the printed-circuit board VSSA (pin 7) is also the substrate and has the most negative voltage of the IC, a large as possible ground plane is therefore recommended. The connection between VSSA, VSSD and VSSO must be as short as possible. Pins VDDO and VDDA (pins 9 and 16) must have capacitors connected to the VSSA ground plane closest to the chip. Pin VDDD (pin 8) is fed via a small series resistor (25 Ω). This resistor must be connected as close as possible to pin 8. The POWER-UP (pin 22) is connected via an electrolytic capacitor to ground. This results in a smooth rising of the DAC output currents at power-on. If this is not required then this capacitor can be omitted. Suppression of the higher harmonics by the up-sample filter should be sufficient to protect the amplifiers and the tweeter loudspeakers from excessive HF noise. The band around 4fs cannot be attenuated by the 4ASF filter and is only attenuated by the sample-and-hold effect of the DAC. At frequencies above 100 kHz, additional attenuation achieved by the 1st order post filter, which is built around the buffer operational amplifiers. In total a 2nd order level of filtering can be found above 100 kHz. In terms of power the audio out-of-band power is approximately 15 × 10−4 of the audio in-band power. |
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