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TDA1314 데이터시트(PDF) 12 Page - NXP Semiconductors

부품명 TDA1314
상세설명  Quadruple filter DAC
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제조업체  PHILIPS [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA1314 데이터시트(HTML) 12 Page - NXP Semiconductors

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August 1994
13
Philips Semiconductors
Product specification
Quadruple filter DAC
TDA1314T
APPLICATION INFORMATION
The application diagram is illustrated in Fig.6.
All pins used for testing (pins 1, 2, 23, 27 and 28 need not
to be connected due to internal resistors being connected
to ground or being used as test outputs. In the normal
free-running mode it is also not required to connect pin 3.
Jitter on the clock edges of MCLK must be as low as
possible so as not to deteriorate the DAC THD
performance. The jitter time must not be greater than
30 ns.
Vref is the voltage reference pin with an internal resistor
divider. A capacitor of 22
µF is used to get the specified
power ripple rejection ratio.
The output operational amplifiers are current-to-voltage
converters by means of the 3 kW resistors connected
between the DAC current outputs (pins 10, 12, 17 and 19)
and the voltage outputs (pins 11, 13, 18 and 20)
respectively. The voltage on the DAC current outputs is
equal to the operational amplifiers virtual ground at Vref in
the event that the operational amplifier is used according
to the application diagram of Fig.6.
Care should be taken, in order to reduce the
electromagnetic compatibility (EMC) that the bandwidth of
the digital signals being applied to pins MCLK, WS, SCK,
SDF and SDR is not larger than necessary. This can be
achieved by controlling the slew rate of the digital source
outputs or connecting a series resistor close to the digital
source output of the driving circuits.
The resistor connected between Rref (pin 14) and ground
is the current reference of the DACs. The voltage on Rref is
equal to Vref.
On the printed-circuit board VSSA (pin 7) is also the
substrate and has the most negative voltage of the IC, a
large as possible ground plane is therefore recommended.
The connection between VSSA, VSSD and VSSO must be as
short as possible. Pins VDDO and VDDA (pins 9 and 16)
must have capacitors connected to the VSSA ground plane
closest to the chip. Pin VDDD (pin 8) is fed via a small series
resistor (25
Ω). This resistor must be connected as close
as possible to pin 8.
The POWER-UP (pin 22) is connected via an electrolytic
capacitor to ground. This results in a smooth rising of the
DAC output currents at power-on. If this is not required
then this capacitor can be omitted.
Suppression of the higher harmonics by the up-sample
filter should be sufficient to protect the amplifiers and the
tweeter loudspeakers from excessive HF noise. The band
around 4fs cannot be attenuated by the 4ASF filter and is
only attenuated by the sample-and-hold effect of the DAC.
At frequencies above 100 kHz, additional attenuation
achieved by the 1st order post filter, which is built around
the buffer operational amplifiers. In total a 2nd order level
of filtering can be found above 100 kHz. In terms of power
the audio out-of-band power is approximately 15
× 10−4 of
the audio in-band power.


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