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TDA1517A 데이터시트(Datasheet) 10 Page - NXP Semiconductors

부품명 TDA1517A
상세내용  8 W BTL or 2 x 4 W SE power amplifier
PDF  20 Pages
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제조사  PHILIPS [NXP Semiconductors]
홈페이지  http://www.nxp.com
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 10 page
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2001 Apr 17
10
Philips Semiconductors
Product specification
8 W BTL or 2
× 4 W SE power amplifier
TDA1517ATW
Thermal behaviour (PCB design considerations)
The typical thermal resistance [Rth(j-a)] of the IC in the
HTSSOP20 package is 37 K/W if the IC is soldered on a
printed-circuit board with double sided 35
µm copper with
a minimum area of approximately 30 cm2. The actual
usable thermal resistance depends strongly on the
mounting method of the device on the printed-circuit
board, the soldering method and the area and thickness of
the copper on the printed-circuit board.
The bottom ‘heat-spreader’ of the IC has to be soldered
efficiently on the ‘thermal land’ of the copper area of the
printed-circuit board using the re-flow solder technique.
A number of thermal vias in the ‘thermal land’ provide a
thermal path to the opposite copper site of the
printed-circuit board. The size of the surface layers should
be as large as needed to dissipate the heat.
The thermal vias (0.3 mm
∅) in the ‘thermal land’ should
not use web construction techniques, because those will
have high thermal resistance; continuous connection
completely around the via-hole is recommended.
For a maximum ambient temperature of 60
°C the
following calculation can be made: for the application at
VP = 12 V and RL =8 Ω the (ALL-) music power
dissipation approximately 2.0 W;
Tj(max) =Tamb +P × Rth(j-a) =60 °C + 2.0 × 37 = 134 °C.
Note: the above calculation holds for application at
‘average listening level’ music output signals. Applying (or
testing) with sine wave signals will produce approximately
twice the music power dissipation; at worst case condition
this can activate the maximum temperature protection.
handbook, full pagewidth
60
50
40
30
20
10
0
K/W
1
0
number of 35
µm copper layers
234
CU-LAYER 2-4
MGU306
L
L
ON-BOARD-COOLING
COPPER DESIGN
CU-LAYER 1
Rth(j-a)
Rth(j-p)
Fig.5 Thermal resistance of the HTSSOP20 mounted on printed-circuit board.
Rth(j-p) curve is given for practical calculation purpose.
L = 30 mm plus vias




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