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TDA1519CTD 데이터시트(Datasheet) 2 Page - NXP Semiconductors

부품명 TDA1519CTD
상세내용  22WBTL or 2 x 11Wstereo power amplifier
PDF  20 Pages
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제조사  PHILIPS [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo 

 
 2 page
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2000 Mar 08
2
Philips Semiconductors
Product specification
22 W BTL or 2
× 11 W stereo power
amplifier
TDA1519C
FEATURES
• Requires very few external components for Bridge-Tied
Load (BTL)
• Stereo or BTL application
• High output power
• Low offset voltage at output (important for BTL)
• Fixed gain
• Good ripple rejection
• Mute/standby switch
• Load dump protection
• AC and DC short-circuit-safe to ground and VP
• Thermally protected
• Reverse polarity safe
• Capability to handle high energy on outputs (VP =0V)
• No switch-on/switch-off plop
• Protected against electrostatic discharge
• Low thermal resistance
• Identical inputs (inverting and non-inverting)
• Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line (SIL) power or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-2) the heatsink is
positioned on top of the package, thereby allowing an
external heatsink to be mounted on top. The heatsink of
the TDA1519CTD (SOT397-1) is facing the PCB thereby
allowing the heatsink to be soldered on the copper area of
the PCB.
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA1519C
SIL9P
plastic single in-line power package; 9 leads
SOT131-2
TDA1519CSP
SMS9P
plastic surface mounted single in-line power package; 9 leads
SOT354-1
TDA1519CTH
HSOP20
heatsink small outline package; 20 leads; low stand-off
SOT418-2
TDA1519CTD
HSOP20
heatsink small outline package; 20 leads
SOT397-1




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