January 1985

6

Philips Semiconductors

Product specification

Spatial, stereo and pseudo-stereo sound

circuit

TDA3810

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT102-1

93-10-14

95-01-23

UNIT

A

max.

12

(1)

(1)

(1)

cD

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

1.40

1.14

0.53

0.38

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

0.254

2.54

7.62

8.25

7.80

9.5

8.3

0.85

4.7

0.51

3.7

inches

0.055

0.044

0.021

0.015

0.013

0.009

1.40

1.14

0.055

0.044

0.86

0.84

0.26

0.24

0.15

0.13

0.01

0.10

0.30

0.32

0.31

0.37

0.33

0.033

0.19

0.020

0.15

c

(e )

1

A

L

e

D

Z

18

1

10

9

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

DIP18: plastic dual in-line package; 18 leads (300 mil)

SOT102-1