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ABM7 데이터시트(HTML) 1 Page - Abracon Corporation

부품명 ABM7
상세내용  MINI LOW PROFILE CERAMIC SURFACE MOUNT MICROPROCESSOR CRYSTALS
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제조사  ABRACON [Abracon Corporation]
홈페이지  http://www.abracon.com/index.htm
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ABM7 데이터시트(HTML) 1 Page - Abracon Corporation

   
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Dimensions: inch (mm)
NOTES:
Frequency Range
Operation Mode
Operating Temperature
Storage Temperature
Frequency Tolerance @ 25°C
Frequency Stability over Temp.
Equivalent Series Resistance
(ESR)
Shunt Capacitance C0
Load Capacitance CL
Drive Level
Aging at 25°C First Year
Insulation Resistance
0.047Max
(1.2Max)
0.130±.008
(3.3±0.2)
0.079
0.031
(0.8)
(2.0)
0.20
(3.0)
0.236±.008
(6.0±0.2)
0.094
(2.4)
ELECTRODE
ARRANGEMENT
0.102
(2.6)
Recommended land pattern
0.075
(1.9)
0.075
(1.9)
* standard temperature only.
** + 100 ppm only.
# Option Z may apply to extended temperatures.
Environmental, and mechanical specifications, see appendix C. Group 2.
Marking, see appendix G.
Tape and Reel, see appendix H.(1,000 pcs/reel)
Recommended handling, see appendix F.
Application notes, see appendix A.
Reflow profile, see appendix E.
ABRACON IS
ABRACON IS
ISO 9001 / QS 9000
ISO 9001 / QS 9000
CERTIFIED
CERTIFIED
ABRACON IS
ISO 9001 / QS 9000
CERTIFIED
30332 Esperanza, Rancho Santa Margarita, California 92688
tel 949-546-8000 | fax 949-546-8001 | www.abracon.com
|||||||||||||||
ABM7
MINI LOW PROFILE CERAMIC SURFACE MOUNT
MINI LOW PROFILE CERAMIC SURFACE MOUNT
MICROPROCESSOR CRYSTALS
MICROPROCESSOR CRYSTALS
MINI LOW PROFILE CERAMIC SURFACE MOUNT
MICROPROCESSOR CRYSTALS
STANDARD SPECIFICATIONS:
OPTIONS AND PART IDENTIFICATION (Left blank if standard):
OUTLINE DRAWING:
- B for -20°C to +70°C
- C for -30°C to +70°C
- N for -30°C to +85°C**
- D for -40°C to +85°C**
- Y for ± 25 ppm max.*
- H for ± 35 ppm max.*
- Z for ± 100 ppm max.#
ABM7 - Frequency - CL - ESR - Temperature - Tolerance - Stability - Packaging
-T for (Tape & Reel)
- 4 for ±30ppm max
- 2 for ±20ppm max
XX.XXXX MHz
RXXX (value in
)
Load cap. in pF
or -S for Series
APPLICATIONS:
• Computers, Modems, Communication equipment.
• Thin equipment
FEATURES:
• Low in height (1.3 mm max.)
• Ceramic package assures high reliability.
• Small size SMD, suitable for high density applications.
• Superior heat-resistant glass sealing.
6.0 X 3.3 X 1.2
PARAMETERS
10.00 MHz - 50.00 MHz
Fundamental AT
-10°C to + 70°C (see options)
- 40°C to + 85°C
± 50 ppm max. (see options)
± 50 ppm max. (see options)
60
Ω max. for 10.0MHz < F < 16.0MHz
50
Ω max. for 16.0MHz < F < 50.0MHz
7pF max.
18pF (see options)
100µW max., 10µW correlation
± 5ppm max.
500M
Ω min. @ 100Vdc ± 15V
_
_


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