1998 Mar 25

5

Philips Semiconductors

Product specification

2

× 0.7 W BTL audio amplifier

TDA8542TS

Headphone connection

A headphone can be connected to the amplifier using two

coupling capacitors for each channel. The common

GND pin of the headphone is connected to the ground of

the amplifier (see Fig.13). In this case the BTL/SE pin must

be either at a logic HIGH level or not connected at all.

The two coupling capacitors can be omitted if it is allowed

to connect the common GND pin of the headphone jack

the application diagram. In this case the BTL/SE pin must

be either at a logic LOW level or connected to ground.

If the BTL/SE pin is at a LOW level, the power amplifier for

the positive loudspeaker terminal is always in mute

condition.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611-E”.

THERMAL CHARACTERISTICS

Note

1. See Section “Thermal design considerations”.

Table 1

Maximum ambient temperature at different conditions

Note

1. See Section “Thermal design considerations”.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

operating

−0.3

+18

V

input voltage

−0.3

repetitive peak output current

−

1A

storage temperature

non-operating

−55

+150

°C

operating ambient temperature

−40

+85

°C

AC and DC short-circuit safe voltage

−

10

V

total power dissipation

−

1.12

W

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to ambient

in free air

K/W

(V)

(

Ω)

(W)

CONTINUOUS SINE WAVE DRIVEN

(W)

(

°C)

3.3

4

2

× 0.65

1.12

3.3

8

2

× 0.55

0.60

84

58

2

× 1.2

1.33

516

2

× 0.70

0.80

62