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HLMP-HM57-SV0XX 데이터시트(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED

부품명 HLMP-HM57-SV0XX
상세설명  Precision Optical Performance Red, Green and Blue 5 mm Standard Oval LEDs
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제조업체  AVAGO [AVAGO TECHNOLOGIES LIMITED]
홈페이지  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-HM57-SV0XX 데이터시트(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED

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Precautions:
Lead Forming:
•  The leads of an LED lamp may be preformed or cut to 
length prior to insertion and soldering on PC board.
•  For better control, it is recommended to use proper 
tool to precisely form and cut the leads to applicable 
length rather than doing it manually.
•  If manual lead cutting is necessary, cut the leads after 
the  soldering  process. The  solder  connection  forms 
a  mechanical  ground  which  prevents  mechanical 
stress  due  to  lead  cutting  from  traveling  into  LED 
package. This is highly recommended for hand solder 
operation, as the excess lead length also acts as small 
heat sink.
Soldering and Handling:
•  Care must be taken during PCB assembly and soldering 
process to prevent damage to the LED component. 
•  LED  component  may  be  effectively  hand  soldered 
to  PCB.  However,  it  is  only  recommended  under 
unavoidable  circumstances  such  as  rework.  The 
closest  manual  soldering  distance  of  the  soldering 
heat  source  (soldering  iron’s  tip)  to  the  body  is 
1.59mm.  Soldering  the  LED  using  soldering  iron  tip 
closer than 1.59mm might damage the LED.
Note: 
1.  PCB with different size and design (component density) will have 
different heat mass (heat capacity). This might cause a change in 
temperature  experienced  by  the  board  if  same  wave  soldering 
setting is used. So, it is recommended to re-calibrate the soldering 
profile again before loading a new type of PCB.
2.  Avago Technologies’ high brightness LED are using high efficiency 
LED die with single wire bond as shown below. Customer is advised 
to  take  extra  precaution  during  wave  soldering  to  ensure  that 
the maximum wave temperature does not exceed 250°C and the 
solder  contact  time  does  not  exceeding  3sec.  Over-stressing  the 
LED during soldering process might cause premature failure to the 
LED due to delamination.
Avago Technologies LED configuration
1.59mm
•  ESD  precaution  must  be  properly  applied  on  the 
soldering  station  and  personnel  to  prevent  ESD 
damage to the LED component that is ESD sensitive. 
Do refer to Avago application note AN 1142 for details. 
The soldering iron used should have grounded tip to 
ensure electrostatic charge is properly grounded.
•  Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note: 
1)  Above  conditions  refers  to  measurement  with  thermocouple 
mounted at the bottom of PCB.
2)  It  is  recommended  to  use  only  bottom  preheaters  in  order  to 
reduce thermal stress experienced by LED.
•  Wave  soldering  parameters  must  be  set  and 
maintained  according  to  the  recommended 
temperature  and  dwell  time.  Customer  is  advised 
to  perform  daily  check  on  the  soldering  profile  to 
ensure that it is always conforming to recommended 
soldering conditions.
Note: Electrical connection between bottom surface of LED die and 
the lead frame is achieved through conductive paste.
•  Any  alignment  fixture  that  is  being  applied  during 
wave  soldering  should  be  loosely  fitted  and  should 
not apply weight or force on LED. Non metal material 
is  recommended  as  it  will  absorb  less  heat  during 
wave soldering process.
•  At elevated temperature, LED is more susceptible to 
mechanical stress. Therefore, PCB must allowed to cool 
down to room temperature prior to handling, which 
includes removal of alignment fixture or pallet.
•  If PCB board contains both through hole (TH) LED and 
other surface mount components, it is recommended 
that surface mount components be soldered on the 
top side of the PCB. If surface mount need to be on the 
bottom side, these components should be soldered 
using reflow soldering prior to insertion the TH LED.
•  Recommended PC board plated through holes (PTH) 
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
•  Over-sizing  the  PTH  can  lead  to  twisted  LED  after 
clinching. On the other hand under sizing the PTH can 
cause difficulty inserting the TH LED.
CATHODE
ANODE
AlInGaP Device
InGaN Device


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