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TDA1175P 데이터시트(Datasheet) 9 Page - STMicroelectronics

부품명 TDA1175P
상세내용  LOW-NOISE VERTICAL DEFLECTION SYSTEM
PDF  13 Pages
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제조사  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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9/13
TDA1175P
MOUNTING INSTRUCTION
The Rth (j-a) can be reduced by soldering the GND
pins to a suitable copper area of the printed circuit
board (Figure 11) or to an external heatsink (Fig-
ure 12).
The diagram of Figure 13 shows the maximum dis-
sipable power Ptot and the Rth (j-a) as a function of
the side "I" of two equal square copper areas hav-
ing a thicknessof 35
µ (1.4 mils).
During soldering the pins temperature must not
exceed 260°C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper
area must be connected to electrical ground.
Figure 11. Example of P.C. Board Copper Area
Figure 12. External Heatsink Mounting
Example
Figure 13. Maximum Power Dissipation and
Junction-ambient Thermal Resistance versus
"I"
Figure 14. Maximum Allowable Power
Dissipation versus Ambient Temperature
COPPER AREA 35
µ THICKNESS
P.C. BOARD
S-3181
11.9 mm
S-3474
38.0 mm
17.0 mm
Ptot
(W)
4
3
2
1
0
Rth
(˚C/W)
80
60
40
20
0
G-3558
0
10
20
30
40
l (mm)
Rth j - amb
Ptot (Tamb = 70˚C)
Ptot
4
3
2
1
0
-50
0
50
100
Tamb(˚C)
G-3559/2
FREE
AIR




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