ML145583

LANSDALE Semiconductor, Inc.

www.lansdale.com

Page 7 of 7

Issue A

OUTLINE DIMENSIONS

SOIC 28W = -7P

(ML145583-7P)

SOG PACKAGE

CASE 751F–04

MIN

MIN

MAX

MAX

MILLIMETERS

INCHES

DIM

A

B

C

D

F

G

J

K

M

P

R

17.80

7.40

2.35

0.35

0.41

0.23

0.13

0

°

10.05

0.25

18.05

7.60

2.65

0.49

0.90

0.32

0.29

8

°

10.55

0.75

0.701

0.292

0.093

0.014

0.016

0.009

0.005

0

°

0.395

0.010

0.711

0.299

0.104

0.019

0.035

0.013

0.011

8

°

0.415

0.029

1.27 BSC

0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15

(0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.13

(0.005) TOTAL IN EXCESS OF D

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

-A-

-B-

114

15

28

-T-

C

SEATING

PLANE

0.010 (0.25)

B

M

M

M

J

-T-

K

26X

G

28X

D

14X

P

F

0.010 (0.25)

T

A

B

M

S

S

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ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

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vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-

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