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ES6430FAB 데이터시트(PDF) 4 Page - ESS Technology,Inc |
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ES6430FAB 데이터시트(HTML) 4 Page - ESS Technology,Inc |
4 / 6 page 4 SAM0632a-013106 ESS Technology, Inc. ES6430 PRODUCT BRIEF QFP MECHANICAL DIMENSIONS QFP MECHANICAL DIMENSIONS The mechanical dimensions for the ES6430 QFP part are shown in Figure 4. Figure 4 Plastic Quad Flat Package (PQFP) Mechanical Dimensions E1 A2 A1 L E D1 b D ES6430 e 1 e1 L1 256-Pin PQFP Table 1 ES6430 256-Pin PQFP Package Dimensions Symbol Descriptions Millimeters Minimum Nominal Maximum D Lead to lead, X-axis — 30.60 — D1 Package’s outside, X-axis — 28.00 — E Lead to lead, Y-axis — 30.60 — E1 Package’s outside, Y-axis — 28.00 — A1 Board standoff 0.25 0.33 0.42 A2 Package thickness 3.20 3.32 3.60 b Lead width 0.13 0.16 0.23 e Lead pitch — 0.40 — e1 Lead gap 0.17 0.24 0.27 L Foot length 0.45 0.60 0.75 L1 Lead length — 1.30 — — Foot angle 0° — 7° — Coplanarity — — 0.102 — Number of leads in X-axis — 64 — — Number of leads in Y-axis — 64 — — Total number of leads — 256 — — Package type — PQFP — For lead-free devices, the solder paste and PCB finish/plating must be 100% lead-free in order to ensure proper solderability. |
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