TLV226x, TLV226xA

Advanced LinCMOS RAILTORAIL

OPERATIONAL AMPLIFIERS

SLOS186C − FEBRUARY 1997 − REVISED AUGUST 2006

2

POST OFFICE BOX 655303

TLV2262 AVAILABLE OPTIONS

PACKAGED DEVICES

TA

VIOmax

AT 25

°C

SMALL

OUTLINE

(D)

CHIP

CARRIER

(FK)

CERAMIC

DIP

(JG)

PLASTIC

DIP

(P)

TSSOP

(PW)

CERAMIC

FLATPACK

(U)

0

°C to 70°C

2.5 mV

TLV2262CD

—

—

TLV2262CP

TLV2262CPWLE

—

−40

°C to 125°C

950

µV

TLV2262AID

—

—

TLV2262AIP

TLV2262AIPWLE

—

−40

°C to 125°C

950

µV

2.5 mV

TLV2262AID

TLV2262ID

—

—

—

—

TLV2262AIP

TLV2262IP

TLV2262AIPWLE

—

—

—

−40

°C to 125°C

950

µV

TLV2262AQD

—

—

—

—

—

−40

°C to 125°C

950

µV

2.5 mV

TLV2262AQD

TLV2262QD

—

—

—

—

—

—

—

—

—

—

−55

°C to 125°C

950

µV

2.5 mV

—

—

TLV2262AMFK

TLV2262MFK

TLV2262AMJG

TLV2262MJG

—

—

—

—

TLV2262AMU

TLV2262MU

† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR).

‡ The PW package is available only left-end taped and reeled.

§ Chips are tested at 25°C.

¶ For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

TLV2264 AVAILABLE OPTIONS

PACKAGED DEVICES

TA

VIOmax

AT 25

°C

SMALL

OUTLINE

(D)

CHIP

CARRIER

(FK)

CERAMIC

DIP

(J)

PLASTIC

DIP

(N)

TSSOP

(PW)

CERAMIC

FLATPACK

(W)

−40

°C to

950

µV

TLV2264AID

—

—

TLV2264AIN

TLV2264AIPWLE

—

−40 C to

125

°C

950

µV

2.5 mV

TLV2264AID

TLV2264ID

—

—

—

—

TLV2264AIN

TLV2264IN

TLV2264AIPWLE

—

—

—

−40

°C to

950

µV

TLV2264AQD

—

—

—

—

—

−40 C to

125

°C

950

µV

2.5 mV

TLV2264AQD

TLV2264QD

—

—

—

—

—

—

—

—

—

—

−55

°C to

125

°C

950

µV

2.5 mV

—

—

TLV2264AMFK

TLV2264MFK

TLV2264AMJ

TLV2264MJ

—

—

—

—

TLV2264AMW

TLV2264MW

† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262IDR).

‡ The PW package is available only left-end taped and reeled.

§ Chips are tested at 25°C.

¶ For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.