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TLRME20CPF 데이터시트(PDF) 1 Page - Toshiba Semiconductor |
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TLRME20CPF 데이터시트(HTML) 1 Page - Toshiba Semiconductor |
1 / 3 page TLRME20CP(F) 2007-10-01 1 TOSHIBA LED Lamp TLRME20CP(F) Panel Circuit Indicator • Lead(Pb)-free products (lead: Sn-Ag-Cu) • 5mm package • InGaAℓP technology • All plastic mold type • Colored clear lens • High intensity light emission • Excellent low current light output • Applications: outdoor message signboards, safety equipment, automotive use, etc Line-Up Product Name Color Material TLRME20CP(F) Red P InGaAl Absolute Maximum Ratings (Ta = 25°C) Product Name Forward Current IF (mA) Reverse Voltage VR (V) Power Dissipation PD (mW) Operating Temperature Topr (°C) Storage Temperature Tstg (°C) TLRME20CP(F) 50 4 120 −40~100 −40~120 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical and Optical Characteristics (Ta = 25°C) Typ. Emission Wavelength Luminous Intensity IV Forward Voltage VF Reverse Current IR Product Name λd λP Δλ IF Min Typ. IF Typ. Max IF Max VR TLRME20CP(F) 626 (636) 23 20 4760 12000 20 1.9 2.4 20 50 4 Unit nm mA mcd mA V mA μA V (Note):Lamps are classified into the following ranks according to their luminous intensity, and packed in boxes by each rank. V: 4760 −12900 mcd, W: 8500−23000 mcd, X: 15300 mcd− Precautions Please be careful of the following: • Soldering temperature: 260°C max, soldering time: 3 s max (soldering portion of lead: up to 1.6 mm from the body of the device) • If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress to the resin. Soldering should be performed after lead forming. • This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light. Unit: mm JEDEC ― JEITA ― TOSHIBA 4-6J1 Weight: 0.31 g(Typ.) |
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