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์ ์๋ถํ ๋ฐ์ดํฐ์ํธ ๊ฒ์์์ง |
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์ ์๋ถํ ๋ฐ์ดํฐ์ํธ ๊ฒ์์์ง |
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BYW77P-200 ๋ฐ์ดํฐ์ํธ(HTML) 3 Page - STMicroelectronics |
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BYW77P-200 ๋ฐ์ดํฐ์ํธ(HTML) 3 Page - STMicroelectronics |
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0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 100 200 300 400 500 I M(A) P=20W P=30W P=40W T I M =tp/T tp Fig.2 : Peak current versus form factor. Tj= 125 C o IFM(A) 0.1 1 10 100 300 VFM(V) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Fig.3 : Forward voltage drop versus forward current (maximum values). 0.1 1.0 0.2 0.5 Zth(j-c) (tp. ) K= Rth(j-c) =0 . 5 =0 . 2 =0 .1 Singl e puls e tp(s) T =tp/T tp 1.0E-03 1.0E-02 1.0E-01 1. 0E+00 K Fig.4 : Relative variation of thermal impedance junction to case versus pulse duration. 0 5 10 15 20 25 30 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5 30.0 =0.05 =0.1 =0.2 =0.5 T =tp/T tp IF(av)(A) PF(av)(W) =1 Fig.1 : Average forward power dissipation versus average forward current. 0.001 0.01 0.1 1 0 50 100 150 200 250 IM t =0.5 t(s) IM(A) Tc=25 C o Tc=50 C o Tc=100 C o Fig.6 : Non repetitive surge peak forward current versus overload duration. (BYW81PI) 0.001 0.01 0.1 1 0 50 100 150 200 250 300 IM t =0.5 t(s) IM(A) Tc=25 C o Tc=75 C o Tc=125 C o Fig.5 : Non repetitive surge peak forward current versus overload duration. (BYW81P) BYW77P/PI-200 3/5 |
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