전자부품 데이터시트 검색엔진 |
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FMA3008 데이터시트(PDF) 7 Page - Filtronic Compound Semiconductors |
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FMA3008 데이터시트(HTML) 7 Page - Filtronic Compound Semiconductors |
7 / 8 page Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filtronic.com 7 Production Datasheet v2.9 FMA3008 BIASING CIRCUIT SCHEMATIC: ASSEMBLY DIAGRAM: It is recommended that the RF connections be made using two bond wires 25µm in diameter and a maximum length of 300µm. Optimum input and output return loss can be achieved, to compensate for bond wire length, with the addition of a microstrip transformer, shown in the diagram below. Substrate: Alumina Thickness: 635µm Dimensions in mm Transformer Impedance 36 Ω Electrical Length 21º at 10GHz 0.61 0.61 To Evaluation Board via an 0402 Surface Mounted capacitor 100pF Chip Capacitors To Evaluation Board via an 0402 Surface Mounted capacitor 100pF Chip Capacitor 0.65 0.65 1.1 1.1 100nF 100pF RF Output VG 100pF 100nF RF Input VDD BILL OF MATERIALS: COMPONENT All RF tracks should be 50 Ω characteristic material Capacitor, 100pF, chip capacitor Capacitor, 100pF, 0402 |
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유사한 설명 - FMA3008 |
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