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M27V800 데이터시트(PDF) 5 Page - STMicroelectronics

부품명 M27V800
상세설명  8 Mbit 1Mb x8 or 512Kb x16 Low Voltage UV EPROM and OTP EPROM
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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M27V800 데이터시트(HTML) 5 Page - STMicroelectronics

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M27V800
Table 7. Read Mode DC Characteristics (1)
(TA = 0 to 70 °C; VCC = 3.3V ± 10%; VPP =VCC)
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Maximum DC voltage on Output is VCC +0.5V.
Symbol
Parameter
Test Condition
Min
Max
Unit
ILI
Input Leakage Current
0V
≤ VIN ≤ VCC
±1
µA
ILO
Output Leakage Current
0V
≤ VOUT ≤ VCC
±10
µA
ICC
Supply Current
E=VIL,G= VIL,IOUT = 0mA,
f = 8MHz, VCC ≤ 3.6V
30
mA
E=VIL,G= VIL,IOUT = 0mA,
f = 5MHz, VCC ≤ 3.6V
20
mA
ICC1
Supply Current (Standby) TTL
E= VIH
1mA
ICC2
Supply Current (Standby) CMOS
E> VCC –0.2V, VCC ≤ 3.6V
20
µA
IPP
Program Current
VPP =VCC
10
µA
VIL
Input Low Voltage
–0.3
0.8
V
VIH
(2)
Input High Voltage
2
VCC +1
V
VOL
Output Low Voltage
IOL = 2.1mA
0.4
V
VOH
Output High Voltage TTL
IOH = –400µA
2.4
V
For the most efficient use of these two control
lines, E should be decoded and used as the prima-
ry device selecting function, while G should be
made a common connection to all devices in the
array and connected to the READ line from the
system control bus. This ensures that all deselect-
ed memory devices are in their low power standby
mode and that the output pins are only active
when data is required from a particular memory
device.
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require carefull decoupling of the
supplies to the devices. The supply current ICC
has three segments of importance to the system
designer: the standby current, the active current
and the transient peaks that are produced by the
falling and rising edges of E.
The magnitude of the transient current peaks is
dependant on the capacititive and inductive load-
ing of the device outputs. The associated transient
voltage peaks can be supressed by complying
with the two line output control and by properly se-
lected decoupling capacitors. It is recommended
that a 0.1
µF ceramic capacitor is used on every
device between VCC and VSS. This should be a
high frequency type of low inherent inductance
and should be placed as close as possible to the
device. In addition, a 4.7
µF electrolytic capacitor
should be used between VCC and VSS for every
eight devices. This capacitor should be mounted
near the power supply connection point. The pur-
pose of this capacitor is to overcome the voltage
drop caused by the inductive effects of PCB trac-
es.


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