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KMPC860ENZQ66D4 데이터시트(Datasheet) 9 Page - Freescale Semiconductor, Inc

부품명 KMPC860ENZQ66D4
상세내용  PowerQUICC™ Family Hardware Specifications
PDF  80 Pages
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제조사  FREESCALE [Freescale Semiconductor, Inc]
홈페이지  http://www.freescale.com
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MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
Freescale Semiconductor
9
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC860.
Table 4. MPC860 Thermal Resistance Data
Rating
Environment
Symbol
ZP
MPC860P
ZQ / VR
MPC860P
Unit
Mold Compound Thickness
0.85
1.15
mm
Junction-to-ambient 1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
34
34
•C/W
C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal.
22
22
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
3
27
27
Four-layer board (2s2p)
RθJMA
3
18
18
Junction-to-board 4
4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
RθJB
14
13
Junction-to-case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad
packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from
the junction to the exposed pad without contact resistance.
RθJC
68
Junction-to-package top 6
6 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
Natural convection
ΨJT
22




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