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AS5130

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical

Characteristics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Supply Voltage

0.3

7

V

Only relevant for polling operation mode,

supply voltage with capacitor of the

of AVDD

Input Pin Voltage

V

Input Current (latchup immunity)

-100

100

mA

Norm: EIA/JESD78 ClassII Level A

Electrostatic Discharge

±2

kV

Norm: JESD22-A114E

Package Thermal Resistance SSOP-16

137.1

K/W

Still Air / Single Layer PCB

Package Thermal Resistance SSOP-16

70

86

K/W

Still Air / Multi Layer PCB, JEDEC Standard

Testboard

Storage Temperature

-55

125

ºC

Ambient Temperature

-40

125

ºC

Junction Temperature

150

ºC

Package body temperature

260

ºC

Norm: IPC/JEDEC J-STD-020C.

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages

is matte tin (100% Sn).

Humidity non-condensing

5

85

%