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FC30TR 데이터시트(PDF) 11 Page - STMicroelectronics |
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FC30TR 데이터시트(HTML) 11 Page - STMicroelectronics |
11 / 13 page FC30 Package information 11/13 6 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 7. LGA 14: mechanical data and package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A1 0.920 1.000 0.0362 0.0394 A2 0.700 0.0275 A3 0.180 0.220 0.260 0.0071 0.0087 0.0102 D1 2.850 3.000 3.150 0.1122 0.1181 0.1240 E1 4.850 5.000 5.150 0.1909 0.1968 0.2027 e 0.800 0.0315 d 0.300 0.0118 L1 4.000 0.1575 N 1.360 0.0535 N1 1.200 0.0472 P1 0.965 0.975 0.985 0.0380 0.0384 0.0386 P2 0.640 0.650 0.660 0.0252 0.0256 0.0260 T1 0.750 0.800 0.850 0.0295 0.0315 0.0335 T2 0.450 0.500 0.550 0.0177 0.0197 0.0217 R 1.200 1.600 0.0472 0.0630 h 0.150 0.0059 k 0.050 0.0020 i 0.100 0.0039 s 0.100 0.0039 LGA14 (3x5x0.92mm) Pitch 0.8mm Land Grid Array Package 7773587 C |
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