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X00602MA1AA2 데이터시트(PDF) 3 Page - STMicroelectronics |
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3 / 9 page X006 Characteristics 3/9 Table 3. Thermal resistances Symbol Parameter Value Unit Rth(j-a) Junction to ambient (DC) TO-92 150 °C/W S = 5 cm2 SOT-223 60 Rth(j-l) Junction to lead (DC) TO-92 70 Rth(j-t) Junction to tab (DC) SOT-223 30 Figure 1. Maximum average power dissipation versus average on-state current Figure 2. Average and DC on-state current versus case temperature (TO-92) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.0 0.1 0.2 0.3 0.4 0.5 0.6 P(W) I (A) T(AV) α = 180° 360° α 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 25 50 75 100 125 I (A) T(AV) T (°C) l α = 180° D.C. TO-92 Figure 3. Average and D.C. on-state current versus ambient temperature (epoxy printed circuit board FR4, copper thickness = 35 µm, SCU = 0.5 cm 2) (TO-92) Figure 4. Average and DC on-state current versus case temperature (SOT-223) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 25 50 75 100 125 I (A) T(AV) T (°C) amb α = 180° D.C. TO-92 S = 0.5 cm CU 2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 25 50 75 100 125 I (A) T(AV) T (°C) tab α = 180° D.C. SOT-223 |
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