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IRFP4368PBF 데이터시트(PDF) 2 Page - International Rectifier |
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IRFP4368PBF 데이터시트(HTML) 2 Page - International Rectifier |
2 / 8 page IRFP4368PbF 2 www.irf.com Notes: Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 195A. Note that current limitations arising from heating of the device leads may occur with some lead mounting arrangements. Refer to App Notes (AN-1140). Repetitive rating; pulse width limited by max. junction temperature. Limited by T Jmax, starting TJ = 25°C, L = 0.022mH RG = 25Ω, IAS = 195A, VGS =10V. Part not recommended for use above this value. S D G I SD ≤ 195A, di/dt ≤ 1740A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
Pulse width ≤ 400µs; duty cycle ≤ 2%. Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS. When mounted on 1" square PCB (FR-4 or G-10 Material). For recom mended footprint and soldering techniques refer to application note #AN-994. Rθ is measured at TJ approximately 90°C. Static @ TJ = 25°C (unless otherwise specified) Symbol Parameter Min. Typ. Max. Units V(BR)DSS Drain-to-Source Breakdown Voltage 75 ––– ––– V ∆V (BR)DSS/ ∆T J Breakdown Voltage Temp. Coefficient ––– 0.077 ––– V/°C RDS(on) Static Drain-to-Source On-Resistance ––– 1.46 1.85 m Ω VGS(th) Gate Threshold Voltage 2.0 ––– 4.0 V IDSS Drain-to-Source Leakage Current ––– ––– 20 µA ––– ––– 250 IGSS Gate-to-Source Forward Leakage ––– ––– 100 nA Gate-to-Source Reverse Leakage ––– ––– -100 Dynamic @ TJ = 25°C (unless otherwise specified) Symbol Parameter Min. Typ. Max. Units gfs Forward Transconductance 650 ––– ––– S Qg Total Gate Charge ––– 380 570 nC Qgs Gate-to-Source Charge ––– 79 ––– Qgd Gate-to-Drain ("Miller") Charge ––– 105 ––– Qsync Total Gate Charge Sync. (Qg - Qgd) ––– 275 ––– RG(int) Internal Gate Resistance ––– 0.80 ––– Ω td(on) Turn-On Delay Time ––– 43 ––– ns tr Rise Time ––– 220 ––– td(off) Turn-Off Delay Time ––– 170 ––– tf Fall Time ––– 260 ––– Ciss Input Capacitance ––– 19230 ––– pF Coss Output Capacitance ––– 1670 ––– Crss Reverse Transfer Capacitance ––– 770 ––– Coss eff. (ER) Effective Output Capacitance (Energy Related) i ––– 1700 ––– Coss eff. (TR) Effective Output Capacitance (Time Related) h ––– 1410 ––– Diode Characteristics Symbol Parameter Min. Typ. Max. Units IS Continuous Source Current ––– ––– 350 c A (Body Diode) ISM Pulsed Source Current ––– ––– 1280 (Body Diode) di VSD Diode Forward Voltage ––– ––– 1.3 V trr Reverse Recovery Time ––– 130 200 ns TJ = 25°C VR = 64V, ––– 140 210 TJ = 125°C IF = 195A Qrr Reverse Recovery Charge ––– 450 680 nC TJ = 25°C di/dt = 100A/µs g ––– 530 800 TJ = 125°C IRRM Reverse Recovery Current ––– 9.1 ––– A TJ = 25°C ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) ID = 195A RG = 2.7 Ω VGS = 10V g VDD = 49V ID = 195A, VDS =0V, VGS = 10V TJ = 25°C, IS = 195A, VGS = 0V g integral reverse p-n junction diode. Conditions VGS = 0V, ID = 250µA Reference to 25°C, ID = 5mA d VGS = 10V, ID = 195A g VDS = VGS, ID = 250µA VDS = 75V, VGS = 0V VDS = 75V, VGS = 0V, TJ = 125°C MOSFET symbol showing the VDS = 38V Conditions VGS = 10V g VGS = 0V VDS = 50V ƒ = 100kHz VGS = 0V, VDS = 0V to 60V i VGS = 0V, VDS = 0V to 60V h Conditions VDS = 50V, ID = 195A ID = 195A VGS = 20V VGS = -20V |
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