Available on Tape

and Reel for Pick and

Place Manufacturing.

USA/Canada:

Toll Free:

Europe

:

(315) 432-8909

(800) 411-6596

+44 2392-232392

Model J0060L5050A00

Rev C

Mounting Configuration:

In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used

to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published

specifications.

All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical

and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/

An example of the PCB footprint used in the testing of these parts is shown on below. In specific designs, the transmission

line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place

equipment tolerances.

Mounting Footprint

Dimensions are in Inches [Millimeters]

Circuit Pattern

Footprint Pad (s)

Solder Resist

Transmission

Line

4X .002

[0.05]

4X .011

[0.29]

6X .011

[0.28]

.027

[0.69]

.012

[0.31]

Plated thru

holes to

ground

Part Orientation (Top View)