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TPI12011NRL 데이터시트(PDF) 7 Page - STMicroelectronics |
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TPI12011NRL 데이터시트(HTML) 7 Page - STMicroelectronics |
7 / 9 page TPI Package information 7/9 4 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 11. SO-8 footprint, dimensions in mm (inches) Table 5. SO-8 dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 1.75 0.069 A1 0.1 0.25 0.004 0.010 A2 1.25 0.049 b 0.28 0.48 0.011 0.019 C 0.17 0.23 0.007 0.009 D 4.80 4.90 5.00 0.189 0.193 0.197 E 5.80 6.00 6.20 0.228 0.236 0.244 E1 3.80 3.90 4.00 0.150 0.154 0.157 e 1.27 0.050 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 L1 1.04 0.041 k0° 8° 0° 8° ppp 0.10 0.004 E1 D 8 4 1 5 E e A A2 b A1 ppp C C k h x 45° L L1 Seating Plane C 6.8 (0.268) 4.2 (0.165) 1.27 (0.050) 0.6 (0.024) |
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