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SN74SSQE32882ZCJR 데이터시트(PDF) 3 Page - Texas Instruments |
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SN74SSQE32882ZCJR 데이터시트(HTML) 3 Page - Texas Instruments |
3 / 8 page PACKAGE INFORMATION PINOUT CONFIGURATION 1 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L M N P R T U V W Y SN74SSQE32882 www.ti.com .................................................................................................................................................................................................. SCAS857 – MARCH 2008 The package is an 8-mm × 13.5-mm, 176-pin ball grid array (BGA) with 0.65-mm ball pitch in an 11 × 20 grid. The device pinout supports outputs on the outer two left and right columns to support easy DIMM signal routing. Corresponding inputs are placed in such a way that two devices can be placed back-to-back for four rank modules while the data inputs share the same vias. Each input and output is located close to an associated no-ball position or on the outer two rows to allow for low-cost via technology combined with the small, 0.65-mm ball pitch. NOTE: To request more information on SN74SSQE32882 DDR3 Register/PLL please contact support@ti.com . Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3 |
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