ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

RECOMMENDED OPERATING CONDITIONS

TPA6047A4

TERMINAL FUNCTIONS (continued)

TERMINAL

I/O/P

DESCRIPTION

NAME

NO.

ROUT+

20

O

Right-channel positive audio output

HP_EN

22

I

Headphone channel enable logic input; active high enable. HIGH=ENABLE.

SPKR_EN

23

I

Speaker channel enable logic input; active high enable. HIGH=ENABLE.

BYPASS

24

P

Common-mode bias voltage for speaker preamplifiers

REG_EN

25

I

Enable pin (Active HIGH) for turning on/off LDO. HIGH=ENABLE

HP_INR

26

I

Headphone right-channel audio input

HP_INL

27

I

Headphone left-channel audio input

SGND

28

P

Signal ground, connect to CPGND and SPGND

REG_OUT

29

O

Regulated 4.75-V output

VDD

30

P

Positive power supply

GAIN0

31

I

Bit 0, MSB, of gain select bits

GAIN1

32

I

Bit 1, LSB, of gain select bits

Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is required for

Thermal Pad

Die Pad

P

mechanical stability and will enhance thermal performance.

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

Supply voltage

HPVDD, VDD, SPVDD, CPVDD

–0.3 to 6

V

SPKR_LIN+, SPKR_LIN-, SPKR_RIN+, SPKR_RIN-,

–0.3 to 6.3

HP_EN,GAIN0, GAIN1, SPK_EN, REG_EN

Input voltage

V

HP_INL, HP_INR HP Enabled

–3.5 to 3.5

HP_INL, HP_INR HP not Enabled

–0.3 to 3.5

Continuous total power dissipation

See Dissipation Rating Table

Operating free-air temperature range

–40 to 85

°C

Operating junction temperature range

–40 to 150

°C

Storage temperature range

–65 to 150

°C

Electrostatic discharge

HBM for HP_OUTL and HP_OUTR

8

kV

CDM

500

V

Electrostatic discharge,

all other pins

HBM

2

kV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DERATING FACTOR

RHB

5.06 W

40 mW/°C

4.04 W

3.23 W

(1)

The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. Refer to the Texas Instruments document,

PowerPAD™ Thermally Enhanced Package application report (literature number SLMA002) for more information regarding the

PowerPAD™ package.

MIN

MAX

UNIT

Supply voltage

VDD, SPVDD

4.5

5.5

V

Supply voltage

HPVDD, CPVDD

3

5.5

V

High-level input voltage

SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN

2

V

4

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