BYM07-50 thru BYM07-400, EGL34A thru EGL34G

Vishay General Semiconductor

www.vishay.com

For technical questions within your region, please contact one of the following:

PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com

Document Number: 88580

Revision: 27-Aug-08

630

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Figure 3. Typical Instantaneous Forward Characteristics

Figure 4. Typical Reverse Characteristics

Instantaneous Forward Voltage (V)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

100

10

1

0.1

0.01

EGL34A - EGL34D

EGL34F & EGL34G

T

T

Pulse Width = 300 µs

1 % Duty Cycle

Percent of Rated Peak Reverse Voltage (%)

0

20

40

60

80

100

0.001

0.01

0.1

1

10

100

T

T

T

T

Figure 5. Typical Junction Capacitance

Figure 6. Typical Transient Thermal Impedance

Reverse Voltage (V)

0.1

1

10

0

5

10

15

20

25

30

35

100

T

f = 1.0 MHz

V

0.01

0.1

10

1

100

100

10

1

0.1

t - Pulse Duration (s)

Solderable Ends

1

2

D2

0.079 (2.0)

MAX.

0.049 (1.25)

MIN.

0.177 (4.5) REF.

Mounting Pad Layout

+ 0

- 0.008 (0.20)

D2 = D1

0.022 (0.559)

0.016 (0.406)

0.145 (3.683)

0.131 (3.327)

0.079 (2.0)

MIN.

DO-213AA (GL34)