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SD24C.TC 데이터시트(PDF) 5 Page - Semtech Corporation |
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SD24C.TC 데이터시트(HTML) 5 Page - Semtech Corporation |
5 / 7 page 5 2004 Semtech Corp. www.semtech.com PRELIMINARY PROTECTION PRODUCTS SD05C through SD24C Device Connection Options The SDxxC TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. The device is symmetrical, so there is no cathode band. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. The ESD transient return path to ground should be kept as short as possible. Place a TVS and decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. Minimize all conductive loops including power and ground loops. Use multilayer boards when possible. Minimize interconnecting line lengths Never run critical signals near board edges. Fill unused portions of the PCB with ground plane. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Device Schematic and Pin Configuration Size Comparison to 0805 MLV SOD-323 0805 MLV Note: Nominal dimensions in inches Component Placement Comparison 0805 MLV on SOD-323 on 0805 MLV Pad SOD-323 on Recommended (SOD-323) Solder Pad 0805 Solder Pad Applications Information |
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