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U1AFS1500-FG256 데이터시트(PDF) 7 Page - Actel Corporation |
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U1AFS1500-FG256 데이터시트(HTML) 7 Page - Actel Corporation |
7 / 27 page Actel Fusion Mixed-Signal FPGA for the MicroBlade AdvancedMC Solution Pr el iminar y v0 .4 3-7 Thermal Characteristics Introduction The temperature variable in the Actel Designer software refers to the junction temperature, not the ambient, case, or board temperatures. This is an important distinction because dynamic and static power consumption will cause the chip's junction temperature to be higher than the ambient, case, or board temperatures. EQ 3-1 through EQ 3-3 give the relationship between thermal resistance, temperature gradient, and power. EQ 3-1 EQ 3-2 EQ 3-3 where θ JA = Junction-to-air thermal resistance θ JB = Junction-to-board thermal resistance θ JC = Junction-to-case thermal resistance TJ = Junction temperature TA = Ambient temperature TB = Board temperature (measured 1.0 mm away from the package edge) TC = Case temperature P = Total power dissipated by the device θ JA T J θ A – P ----------------- = θ JB T J T B – P ---------------- = θ JC T J T C – P ----------------- = Table 3-6 • Package Thermal Resistance Product θ JA θ JC θ JB Units Still Air 1.0 m/s 2.5 m/s U1AFS250-FG256 33.7 30.0 28.3 9.3 24.8 °C/W U1AFS600-FG256 28.9 25.2 23.5 6.8 19.9 °C/W U1AFS1500-FG256 23.3 19.6 18.0 4.3 14.2 °C/W |
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