FEATURES AND SPECIFICATIONS

2.00 by 2.25mm

(.079 by .089") Pitch

5-Row, 6-Row and 8-Row

Module-to-Backplane

Connector System

Features and Benefits

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Up to 5.0 Gbps bandwidth per signal pair enables

state-of-the-art system design and performance

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2.00 by 2.25mm (.079 by .089”) pitch provides real

signal density of 10 differential pairs for 5-row and

6-row and 15 differential pairs for 8-row per

centimeter (25 and 38 pairs respectively per inch)

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Minimum distance between daughtercards:

– 5-row system offers 15.00mm (.591")

– 6-row system offers 18.00mm (.709")

– 8-row system offers 22.00mm (.866")

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Ground planes between signal columns provide

tightly controlled impedance for rise times down to

50 picoseconds (10-90%). This ensures very low

cross talk between signals within and between

columns

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Ground pins are in the same grid as signal pins,

allowing wider channels for PCB routing and traces

up to 0.25mm (.010”) wide

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6-row or 8-row VHDM-HSD wafers can be applied to

row wafers. The combination of VHDM and VHDM-

HSD wafers, grouped together in the same stiffener,

provides cost effective solutions to different

performance parameters

The Very High Density Metric High Speed Differential

(VHDM-HSD) connector system has been expanded to

include 5-row, 6-row and 8-row daughtercard and

backplane modules. VHDM-HSD is designed for

differential-pair architecture applications that require

very high interconnect density and signal integrity in a

single-ended configuration.

The same great modularity features and components of

VHDM are provided in the VHDM-HSD. The 5-row and 6-

row systems feature 2 signal pairs per column and the

8-row system features 3 signal pairs per column in

increments of 10 and 25 columns. All circuits are

utilized as signal circuits without the need to use some as

ground circuits.

The daughtercard connector consists of a metal stiffener

just as with the VHDM system. The system combines the

signal wafers, power modules and guidance modules

into one continuous connector that can be ordered as a

single specific part number. The card pitch of the VHDM-

HSD 8-row system is the same as the standard VHDM 8-

row system, allowing both signal wafer types for single

ended and differential pair to be used together. This

modularity and design flexibility allow engineers to

incorporate both connector systems on the same

platforms. The system is based on a 2.00mm (.079")

pitch and includes vertical and right angle products that

can be configured up to 2000 circuits. The maximum

length of a daughtercard connector on a single stiffener

is 300mm (12").

The backplane connectors feature headers with open

ends for continuous side-to-side stacking and headers

with guide pins and polarizing keys on either end to aid

in proper alignment of the mating daughtercard. The

power modules occupy just a small width and hold

sequentially matable pins that each manage 10.0 amps

of current.

Molex offers application tooling for pressing VHDM-HSD

connectors into PCBs as separate modules or as complete

assemblies. VHDM-HSD cable assemblies are also

available for connecting backplane headers to high-

performance cables.

Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.