TLV1393, TLV1393Y, TLV2393, TLV2393Y

DUAL DIFFERENTIAL COMPARATORS

SLCS121A – AUGUST 1993 – REVISED APRIL 1994

4

POST OFFICE BOX 655303

TLV1393Y chip information

This chip, when properly assembled, displays characteristics similar to the TLV1393. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 13 TYPICAL

BONDING PADS: 3.54

× 3.54 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN +

1IN –

VCC

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(4)

GND

32

38

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)