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TLE8263E 데이터시트(PDF) 9 Page - Infineon Technologies AG

부품명 TLE8263E
상세설명  Universal System Basis Chip HERMES Rev. 1.0
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제조업체  INFINEON [Infineon Technologies AG]
홈페이지  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE8263E 데이터시트(HTML) 9 Page - Infineon Technologies AG

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Data Sheet
9
Rev. 1.0, 2009-03-31
TLE8263E
Pin Configuration
26
RxDLIN
LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 2.1
as well as SAE J2602-2; push-pull output; LOW in dominant state.
27
TxDLIN2
LIN Transceiver Data Input; according to ISO 9141 and LIN specification 2.1 as
well as SAE J2602-2. integrated pull-up resistor.
28
RxDLIN2
LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 2.1
as well as SAE J2602-2; push-pull output; LOW in dominant state.
29
n.c.
Not connected
30
n.c.
Not connected
31
GND
Ground
32
Bus2
LIN Bus 2; Bus line for the LIN interface, according to ISO 9141 and LIN
specification 2.1 as well as SAE J2602-2.
33
n.c
not connected
34
WK
Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals
coming from, for example, an external switch panel; also used as wake-up input;
35
Limp Home
Fail-Safe Function Output; Open drain. Active LOW.
36
Test
SBC SW Development Mode entry; Connect to GND for activation; Integrated pull-
up resistor. Connect to
V
S or leave open for normal operation.
EDP
-
Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.1)
1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed
die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC
performance.
Pin
Symbol
Function


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