전자부품 데이터시트 검색엔진 |
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LFD435-69-XX-PF 데이터시트(PDF) 9 Page - LIGITEK electronics co., ltd. |
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LFD435-69-XX-PF 데이터시트(HTML) 9 Page - LIGITEK electronics co., ltd. |
9 / 9 page 8/8 Page Description The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test Solder Resistance Test Reliability Test: High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item PART NO. LFD435/69-XX-PF |
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