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EQW006A0B 데이터시트(PDF) 18 Page - Lineage Power Corporation |
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EQW006A0B 데이터시트(HTML) 18 Page - Lineage Power Corporation |
18 / 19 page Data Sheet March 26, 2008 EQW006 Series, Eight Brick Power Modules: DC-DC Converter 36 – 75Vdc Input; 12Vdc Output; 6A Output Current LINEAGE POWER 18 Surface Mount Information (continued) 200 205 210 215 220 225 230 235 240 0 1020 30 4050 60 Figure 19. Time Limit Curve Above 205 oC for Tin/Lead (Sn/Pb) process. Lead Free Soldering The –Z version of the EQW006 modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig. 20. MSL Rating The EQW006 modules have a MSL rating of 2. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). Per J-STD-020 Rev. C 0 50 100 150 200 250 300 Reflow Time (Seconds) Heating Zone 1°C/Second Peak Temp 260°C * Min. Time Above 235°C 15 Seconds *Time Above 217°C 60 Seconds Cooling Zone Figure 20. Recommended linear reflow profile using Sn/Ag/Cu solder. Through-Hole Lead-Free Soldering Information The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3 °C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210 °C. For Pb solder, the recommended pot temperature is 260 °C, while the Pb-free solder pot is 270 °C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details. |
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