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QBK025A0B71-BPH 데이터시트(PDF) 12 Page - Lineage Power Corporation

부품명 QBK025A0B71-BPH
부품 상세설명  36-55Vdc Input; 12Vdc Output Voltage; 25A Output Current
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제조업체  LINEAGEPOWER [Lineage Power Corporation]
홈페이지  http://www.lineagepower.com
Logo LINEAGEPOWER - Lineage Power Corporation

QBK025A0B71-BPH 데이터시트(HTML) 12 Page - Lineage Power Corporation

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Data Sheet
March 27, 2008
QBK025A0B DC-DC Power Modules:
36-55Vdc Input; 12Vdc Output Voltage; 25A Output Current
LINEAGE POWER
12
Layout Considerations
The QBK025 power module series are low profile in
order to be used in fine pitch system card architectures.
As such, component clearance between the bottom of
the power module and the mounting board is limited.
Avoid placing copper areas on the outer layer directly
underneath the power module. Also avoid placing via
interconnects underneath the power module.
For additional layout guide-lines, refer to FLTR100V10
data sheet.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3
°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot
temperature is 260
°C, while the Pb-free solder pot is
270
°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole Pb
or Pb-free reflow process. If additional information is
needed, please consult with your Lineage Power
representative for more details.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board Mounted Power Modules:
Soldering and Cleaning Application Note
(AP01-056EPS).


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