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SW001A2B91 ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 16 Page - Lineage Power Corporation

๋ถ€ํ’ˆ๋ช… SW001A2B91
์ƒ์„ธ๋‚ด์šฉ  18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
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์ œ์กฐ์‚ฌ  LINEAGEPOWER [Lineage Power Corporation]
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SW001A2B91 ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 16 Page - Lineage Power Corporation

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Data Sheet
December 12, 2008
SW/SC001/003 Series DC-DC Power Module:
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
LINEAGE POWER
16
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, Tref used in the
specifications is shown in Figure 49. For reliable
operation this temperature should not exceed 120
oC.
Tref
Figure 49. Tref Temperature Measurement Location.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (TA) for natural
convection and up to 3m/s (600 ft./min) are shown in the
respective Characteristics Curves section.
Please refer to the Application Note โ€œThermal
Characterization Process For Open-Frame Board-
Mounted Power Modulesโ€ for a detailed discussion of
thermal aspects including maximum device
temperatures.
EMC Considerations
Figure 50 shows a suggested configuration to meet the
conducted emission limits of EN55022 Class B.
Notes: C1, C2, C3 and C6 are low impedance SMT
ceramics. C4 is a low impedance polymer film type
(Paktron CS4). Common Mode inductor is Pulse
Engineering type P0354 1.17mH.
VI(+)
SW003A0A
VI(-)
Vo +
Vo -
Pulse P0354
CMC 1.17mH
L1 10uH
C6 2 x 56nF
C5 N/F
C4
4.7uF
Polymer
C1
0.68uF
C2
0.68uF
5V @ 3A
C3
0.68uF
Figure 50. Suggested Configuration for EN55022
Class B.
100K
500K
1M
5M
10M
30M
Frequency(Hz)
10
20
30
40
50
60
70
80
90
EN 55022 Class B Conducted Average dBuV
Figure 51. EMC signature using above filter,
SW003A0A.
For further information on designing for EMC
compliance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
The SW/SC power module series are low profile in order
to be used in fine pitch system card architectures. As
such, component clearance between the bottom of the
power module and the mounting board is limited. Avoid
placing copper areas on the outer layer directly
underneath the power module. Also avoid placing via
interconnects underneath the power module.
For additional layout guide-lines, refer to the
FLTR100V10 data sheet.


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