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BD3532EFV 데이터시트(PDF) 2 Page - Rohm

부품명 BD3532EFV
상세설명  Termination Regulators for DDR-SDRAMs
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제조업체  ROHM [Rohm]
홈페이지  http://www.rohm.com
Logo ROHM - Rohm

BD3532EFV 데이터시트(HTML) 2 Page - Rohm

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ABSOLUTE MAXIMUM RATINGS
BD3533F/FVM/EKN
Parameter
Symbol
BD3533F
BD3533FVM
BD3533EKN
Unit
Input Voltage
VCC
7
*1*2
7
*1*2
7
*1*2
V
Enable Input Voltage
VEN
7
*1*2
7
*1*2
7
*1*2
V
Termination Input Voltage
VTT_IN
7
*1*2
7
*1*2
7
*1*2
V
VDDQ Reference Voltage
VDDQ
7
*1*2
7
*1*2
7
*1*2
V
Output Current
ITT
3
1
3
A
Power Dissipation1
Pd1
560
*3
437.5
*5
500
*6
mW
Power Dissipation2
Pd2
690
*4
-
750
*7
mW
Power Dissipation3
Pd3
-
-
1750
*8
mW
Power Dissipation4
Pd4
-
-
2000
*9
mW
Operating Temperature Range
Topr
-20~+100
-20~+100
-20~+100
Storage Temperature Range
Tstg
-55~+150
-55~+150
-55~+150
Maximum Junction Temperature
Tjmax
+150
+150
+150
*1 Should not exceed Pd.
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
*3 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*4 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
*5 Reduced by 3.5mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*6 Ta≧25℃(no heat sink)4mW/℃ increase.
*7 Ta≧25℃(when mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB which does not have copper on the back side).
*8 Ta≧25℃(when mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB which has 1 layer ( 60mm x 60mm ) of copper on the back side)14mW/℃ increase.
*9 Ta≧25℃(When mounted on board 70mm x 70mm x 1.6mm Glass-epoxy PCB which has 2 layers ( 60mm x 60mm ) of copper on the back side )16mW/℃
increase.
BD3531F
Parameter
Symbol
Limit
Unit
Input Voltage
VCC
7 *
1
V
EN Input Voltage
VEN
7 *
1
V
Termination Input Voltage
VTT_IN
7 *
1
V
VDDQ Reference Voltage
VDDQ
7 *
1
V
Output Current
ITT
3
A
Power Dissipation1
Pd1
560 *
2
mW
Power Dissipation2
Pd2
690 *
3
mW
Operating Temperature Range
Topr
-10~
Storage Temperature Range
Tstg
-55~
Maximum Junction Temperature
Tjmax
+150
*1 Should not exceed Pd.
*2 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*3 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
BD3532F/EFV/KN
Parameter
Symbol
BD3532F
BD3532EFV
BD3532KN
Unit
Input Voltage
VCC
7 *
1
7 *
1
7 *
1
V
Enable Input Voltage
VEN
7 *
1
7 *
1
7 *
1
V
Termination Input Voltage
VTT_IN
7 *
1
7 *
1
7 *
1
V
VDDQ Reference Voltage
VDDQ
7 *
1
7 *
1
7 *
1
V
Output Current
ITT
3
3
3
A
Power Dissipation1
Pd1
560 *
2
-
460 *
5
mW
Power Dissipation2
Pd2
690 *
3
1000 *
4
725 *
6
mW
Operating Temperature Range
Topr
-40~+100
-40~+100
-40~+100
Storage Temperature Range
Tstg
-55~+150
-55~+150
-55~+150
Maximum Junction Temperature
Tjmax
+150
+150
+150
*1 Should not exceed Pd.
*2 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*3 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
*4 Reduced by 8.0mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
*5 Reduced by 3.68mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*6 Reduced by 5.80mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).


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