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BD3532EFV 데이터시트(PDF) 2 Page - Rohm |
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BD3532EFV 데이터시트(HTML) 2 Page - Rohm |
2 / 17 page 2/16 ●ABSOLUTE MAXIMUM RATINGS ◎ BD3533F/FVM/EKN Parameter Symbol BD3533F BD3533FVM BD3533EKN Unit Input Voltage VCC 7 *1*2 7 *1*2 7 *1*2 V Enable Input Voltage VEN 7 *1*2 7 *1*2 7 *1*2 V Termination Input Voltage VTT_IN 7 *1*2 7 *1*2 7 *1*2 V VDDQ Reference Voltage VDDQ 7 *1*2 7 *1*2 7 *1*2 V Output Current ITT 3 1 3 A Power Dissipation1 Pd1 560 *3 437.5 *5 500 *6 mW Power Dissipation2 Pd2 690 *4 - 750 *7 mW Power Dissipation3 Pd3 - - 1750 *8 mW Power Dissipation4 Pd4 - - 2000 *9 mW Operating Temperature Range Topr -20~+100 -20~+100 -20~+100 ℃ Storage Temperature Range Tstg -55~+150 -55~+150 -55~+150 ℃ Maximum Junction Temperature Tjmax +150 +150 +150 ℃ *1 Should not exceed Pd. *2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. *3 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink). *4 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB). *5 Reduced by 3.5mW for each increase in Ta of 1℃ over 25℃(With no heat sink). *6 Ta≧25℃(no heat sink)4mW/℃ increase. *7 Ta≧25℃(when mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB which does not have copper on the back side). *8 Ta≧25℃(when mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB which has 1 layer ( 60mm x 60mm ) of copper on the back side)14mW/℃ increase. *9 Ta≧25℃(When mounted on board 70mm x 70mm x 1.6mm Glass-epoxy PCB which has 2 layers ( 60mm x 60mm ) of copper on the back side )16mW/℃ increase. ◎ BD3531F Parameter Symbol Limit Unit Input Voltage VCC 7 * 1 V EN Input Voltage VEN 7 * 1 V Termination Input Voltage VTT_IN 7 * 1 V VDDQ Reference Voltage VDDQ 7 * 1 V Output Current ITT 3 A Power Dissipation1 Pd1 560 * 2 mW Power Dissipation2 Pd2 690 * 3 mW Operating Temperature Range Topr -10~ ℃ Storage Temperature Range Tstg -55~ ℃ Maximum Junction Temperature Tjmax +150 ℃ *1 Should not exceed Pd. *2 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink). *3 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB). ◎ BD3532F/EFV/KN Parameter Symbol BD3532F BD3532EFV BD3532KN Unit Input Voltage VCC 7 * 1 7 * 1 7 * 1 V Enable Input Voltage VEN 7 * 1 7 * 1 7 * 1 V Termination Input Voltage VTT_IN 7 * 1 7 * 1 7 * 1 V VDDQ Reference Voltage VDDQ 7 * 1 7 * 1 7 * 1 V Output Current ITT 3 3 3 A Power Dissipation1 Pd1 560 * 2 - 460 * 5 mW Power Dissipation2 Pd2 690 * 3 1000 * 4 725 * 6 mW Operating Temperature Range Topr -40~+100 -40~+100 -40~+100 ℃ Storage Temperature Range Tstg -55~+150 -55~+150 -55~+150 ℃ Maximum Junction Temperature Tjmax +150 +150 +150 ℃ *1 Should not exceed Pd. *2 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink). *3 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB). *4 Reduced by 8.0mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB). *5 Reduced by 3.68mW for each increase in Ta of 1℃ over 25℃(With no heat sink). *6 Reduced by 5.80mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB). |
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