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BC807DS 데이터시트(PDF) 3 Page - NXP Semiconductors |
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3 / 7 page 2002 Nov 22 3 NXP Semiconductors Product data sheet PNP general purpose double transistor BC807DS THERMAL CHARACTERISTICS Note 1. Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 1 cm2. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. Notes 1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02. 2. VBE decreases by approximately −2 mV/K with increasing temperature. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 208 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per transistor ICBO collector-base cut-off current VCB = −20 V; IE = 0 − − −100 nA VCB = −20 V; IE = 0; Tj = 150 °C − − −5 μA IEBO emitter-base cut-off current VEB = −5 V; IC = 0 − − −100 nA hFE DC current gain VCE = −1 V; IC = −100 mA; note 1 160 − 400 VCE = −1 V; IC = −500 mA; note 1 40 − − VCEsat collector-emitter saturation voltage IC = −500 mA; IB = −50 mA; note 1 − − −700 mV VBE base-emitter voltage VCE = −1 V; IC = −500 mA; notes 1 and 2 − − −1.2 V Cc collector capacitance VCB = −10 V; IE = Ie = 0; f = 1 MHz − 9 − pF fT transition frequency VCE = −5 V; IC = −10 mA; f = 100 MHz 80 − − MHz |
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