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1-100694-01 데이터시트(PDF) 3 Page - Sensitron |
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3 / 12 page Datasheet SHT21 www.sensirion.com Version 1.0 – January 2010 3/12 Users Guide SHT2x 1 Extended Specifications 1.1 Operating Range The sensor works stable within recommended Normal Range – see Figure 4. Long term exposure to conditions outside Normal Range, especially at humidity >80%RH, may temporarily offset the RH signal (+3%RH after 60h). After return into the Normal Range it will slowly return towards calibration state by itself. See Section 2.3 “Recon- ditioning Procedure” for eliminating the offset. Prolonged exposure to extreme conditions may accelerate ageing. Figure 4 Operating Conditions 1.2 RH accuracy at various temperatures Maximal tolerance for RH accuracy at 25°C is defined in Figure 2. For other temperatures maximal tolerance has been evaluated to be within limits displayed in Figure 58. 100 ±5 90 ±6 ±5 ±4 ±5 ±7 ±8 80 70 60 50 40 30 ±4 ±3 ±3 ±3 ±4 ±6 20 10 ±6 ±5 ±4 ±5 0 ±5 ±7 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Temperature (°C) Figure 5 Maximal tolerance of relative humidity measurements given in %RH for temperatures 0 – 80°C. Please note that above values are maximal tolerances (not including hysteresis) against a high precision reference such as a dew point mirror. Typical deviations are at ±2%RH where maximal tolerance is ±3%RH and about half the maximal tolerance at other values. 8 Details on how Sensirion is specifying and testing accuracy performance are planned to be published on the Sensirion web page. 2 Application Information 2.1 Soldering Instructions The DFN’s die pad (centre pad) and perimeter I/O pads are fabricated from a planar copper lead-frame by over- molding leaving the die pad and I/O pads exposed for mechanical and electrical connection. Both the I/O pads and die pad should be soldered to the PCB. In order to prevent oxidation and optimize soldering, the bottom side of the sensor pads is plated with Ni/Pd/Au. On the PCB the I/O lands9 should be 0.2mm longer than the package I/O pads. Inward corners may be rounded to match the I/O pad shape. The I/O land width should match the DFN-package I/O-pads width 1:1 and the land for the die pad should match 1:1 with the DFN package – see Figure 6. The solder mask10 design for the land pattern preferably is of type Non-Solder Mask Defined (NSMD) with solder mask openings larger than metal pads. For NSMD pads, the solder mask opening should be about 120µm to 150µm larger than the pad size, providing a 60µm to 75µm design clearance between the copper pad and solder mask. Rounded portions of package pads should have a matching rounded solder mask-opening shape to minimize the risk of solder bridging. For the actual pad dimensions, each pad on the PCB should have its own solder mask opening with a web of solder mask between adjacent pads. Figure 6 Recommended metal land pattern for SHT2x. Values in mm. Die pad (centre pad) and NC pads may be left floating or be connected to ground. The outer dotted line represents the outer dimension of the DFN package. For solder paste printing a laser-cut, stainless steel stencil with electro-polished trapezoidal walls and with 0.125mm stencil thickness is recommended. For the I/O pads the stencil apertures should be 0.1mm longer than PCB pads and positioned with 0.1mm offset away from the centre of 9 The land pattern is understood to be the metal layer on the PCB, onto which the DFN pads are soldered to. 10 The solder mask is understood to be the insulating layer on top of the PCB covering the connecting lines. 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Max. Range Normal Range 1.0 1.0 0.3 0.4 2.4 |
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