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SW001A2B9 데이터시트(HTML) 22 Page - Lineage Power Corporation

부품명 SW001A2B9
상세내용  SW/SC001/003 Series DC-DC Converter Power Modules 18-36V & 36-75Vdc Input; 3.3V-15Vdc Output; 1-3.5A Output Current
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제조사  LINEAGEPOWER [Lineage Power Corporation]
홈페이지  http://www.lineagepower.com
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SW001A2B9 데이터시트(HTML) 22 Page - Lineage Power Corporation

 
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Data Sheet
October 5, 2009
SW/SC001/003 Series DC-DC Power Module:
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
LINEAGE POWER
22
Surface Mount Information (continued)
There are several types of SMT reflow technologies
currently used in the industry. These surface
mount power modules can be reliably soldered
using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. The
recommended linear reflow profile using Sn/Pb
solder is shown in Figure 54 and 55. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules
CP connector temperatures.
0
50
100
150
200
250
300
P reheat zo ne
max 4oCs-1
So ak zo ne
30-240s
Heat zo ne
max 4oCs-1
P eak Temp 235oC
Co o ling
zo ne
1-4oCs-1
T
lim above
205oC
REFLOW TIME (S)
Figure 54. Recommended Reflow Profile for Sn/Pb
solder.
Figure 55. Time Limit, Tlim, Curve Above 205
oC
Reflow .
Lead Free Soldering
The –Z version SMT modules of the SW/SC series
are lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 56.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
He ating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 56. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The SW/SC series SMT modules have a MSL rating
of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
200
205
210
215
220
225
230
235
240
0
10
203040
5060
TIME LIMIT (S)


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