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ISL31478EIBZ 데이터시트(PDF) 5 Page - Intersil Corporation |
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ISL31478EIBZ 데이터시트(HTML) 5 Page - Intersil Corporation |
5 / 21 page ISL31470E, ISL31472E, ISL31475E, ISL31478E 5 FN7639.0 June 17, 2010 Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V) Input/Output Voltages A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . ±60V A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω, Note 17) . . . . . . . ±80V RO . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Rating . . . . . . . . . . . . . . . . . . see Specification Table Latch-up (per JESD78, Level 2, Class A) . . . . . . . . . +125°C Recommended Operating Conditions Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . 5V Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C Bus Pin Common Mode Voltage Range . . . . . . -15V to +15V Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Ld PDIP* Package (Notes 5, 7) . . . 105 60 8 Ld SOIC Package (Notes 6, 7). . . . 116 47 14 Ld SOIC Package (Notes 6, 7). . . 88 39 Maximum Junction Temperature (Plastic Package) . . . .+150°C Maximum Storage Temperature Range . . . . -65°C to +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp *Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications. CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. 6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 7. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 8). Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 16) TYP MAX (Note 16) UNITS DC CHARACTERISTICS Driver Differential VOUT (No load) VOD1 Full - - VCC V Driver Differential VOUT (Loaded, Figure 1A) VOD2 RL = 100Ω (RS-422) Full 2.4 3.2 - V RL = 54Ω (RS-485) Full 1.5 2.5 VCC V RL = 54Ω (PROFIBUS, VCC ≥ 5V) Full 2.0 2.5 - RL = 21Ω (Six 120Ω terminations for Star Configurations, VCC ≥ 4.75V) Full 0.8 1.3 - V Change in Magnitude of Driver Differential VOUT for Complementary Output States ΔVOD RL = 54Ω or 100Ω (Figure 1A) Full - - 0.2 V Driver Differential VOUT with Common Mode Load (Figure 1B) VOD3 RL = 60Ω, -7V ≤ VCM ≤ 12V Full 1.5 2.1 VCC V RL = 60Ω, -15V ≤ VCM ≤ 15V (VCC ≥ 4.75V) Full 1.7 2.3 - v Driver Common-Mode VOUT (Figure 1A) VOC RL = 54Ω or 100Ω Full -1 - 3 V Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States ΔVOC RL = 54Ω or 100Ω (Figure 1A) Full - - 0.2 V Driver Short-Circuit Current IOSD DE = VCC, -15V ≤ VO ≤ 15V (Note 10) Full -250 - 250 mA IOSD1 At First Fold-back, 22V ≤ VO ≤ -22V Full -83 - 83 mA IOSD2 At Second Fold-back, 35V ≤ VO ≤ -35V Full -13 - 13 mA |
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