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U1300 데이터시트(PDF) 3 Page - Intel Corporation

부품명 U1300
상세설명  Intel Core Duo Processor and Intel Core Solo Processor on 65 nm Process
Download  91 Pages
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제조업체  INTEL [Intel Corporation]
홈페이지  http://www.intel.com
Logo INTEL - Intel Corporation

U1300 데이터시트(HTML) 3 Page - Intel Corporation

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Datasheet
3
Contents
1Introduction ..............................................................................................................7
1.1
Terminology .......................................................................................................9
1.2
References .........................................................................................................9
2
Low Power Features ................................................................................................ 11
2.1
Clock Control and Low Power States .................................................................... 11
2.1.1
Core Low-Power States ........................................................................... 13
2.1.1.1
C0 State .................................................................................. 13
2.1.1.2
C1/AutoHALT Powerdown State .................................................. 13
2.1.1.3
C1/MWAIT Powerdown State ...................................................... 13
2.1.1.4
Core C2 State........................................................................... 13
2.1.1.5
Core C3 State........................................................................... 14
2.1.1.6
Core C4 State........................................................................... 14
2.1.2
Package Low Power States ...................................................................... 14
2.1.2.1
Normal State............................................................................ 14
2.1.2.2
Stop-Grant State ...................................................................... 14
2.1.2.3
Stop Grant Snoop State ............................................................. 15
2.1.2.4
Sleep State .............................................................................. 15
2.1.2.5
Deep Sleep State ...................................................................... 16
2.1.2.6
Deeper Sleep State ................................................................... 16
2.2
Enhanced Intel SpeedStep® Technology .............................................................. 17
2.3
Extended Low Power States ................................................................................ 18
2.4
FSB Low Power Enhancements ............................................................................ 19
2.5
Processor Power Status Indicator (PSI#) Signal..................................................... 19
3
Electrical Specifications ........................................................................................... 21
3.1
Power and Ground Pins ...................................................................................... 21
3.2
FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 21
3.3
Voltage Identification ......................................................................................... 21
3.4
Catastrophic Thermal Protection .......................................................................... 24
3.5
Signal Terminations and Unused Pins ................................................................... 25
3.6
FSB Frequency Select Signals (BSEL[2:0])............................................................ 25
3.7
FSB Signal Groups............................................................................................. 25
3.8
CMOS Signals ................................................................................................... 27
3.9
Maximum Ratings.............................................................................................. 27
3.10 Processor DC Specifications ................................................................................ 28
4
Package Mechanical Specifications and Pin Information .......................................... 41
4.1
Package Mechanical Specifications ....................................................................... 41
4.1.1
Package Mechanical Drawings .................................................................. 41
4.1.2
Processor Component Keep-Out Zones...................................................... 46
4.1.3
Package Loading Specifications ................................................................ 46
4.1.4
Processor Mass Specifications .................................................................. 46
4.2
Processor Pinout and Pin List .............................................................................. 47
4.3
Alphabetical Signals Reference ............................................................................ 49
5
Thermal Specifications and Design Considerations .................................................. 79
5.1
Thermal Specifications ....................................................................................... 85
5.1.1
Thermal Diode ....................................................................................... 85
5.1.2
Thermal Diode Offset .............................................................................. 87
5.1.3
Intel® Thermal Monitor........................................................................... 87
5.1.4
Digital Thermal Sensor (DTS)................................................................... 89
5.1.5
Out of Specification Detection .................................................................. 90


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