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U1300 데이터시트(PDF) 3 Page - Intel Corporation |
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U1300 데이터시트(HTML) 3 Page - Intel Corporation |
3 / 91 page Datasheet 3 Contents 1Introduction ..............................................................................................................7 1.1 Terminology .......................................................................................................9 1.2 References .........................................................................................................9 2 Low Power Features ................................................................................................ 11 2.1 Clock Control and Low Power States .................................................................... 11 2.1.1 Core Low-Power States ........................................................................... 13 2.1.1.1 C0 State .................................................................................. 13 2.1.1.2 C1/AutoHALT Powerdown State .................................................. 13 2.1.1.3 C1/MWAIT Powerdown State ...................................................... 13 2.1.1.4 Core C2 State........................................................................... 13 2.1.1.5 Core C3 State........................................................................... 14 2.1.1.6 Core C4 State........................................................................... 14 2.1.2 Package Low Power States ...................................................................... 14 2.1.2.1 Normal State............................................................................ 14 2.1.2.2 Stop-Grant State ...................................................................... 14 2.1.2.3 Stop Grant Snoop State ............................................................. 15 2.1.2.4 Sleep State .............................................................................. 15 2.1.2.5 Deep Sleep State ...................................................................... 16 2.1.2.6 Deeper Sleep State ................................................................... 16 2.2 Enhanced Intel SpeedStep® Technology .............................................................. 17 2.3 Extended Low Power States ................................................................................ 18 2.4 FSB Low Power Enhancements ............................................................................ 19 2.5 Processor Power Status Indicator (PSI#) Signal..................................................... 19 3 Electrical Specifications ........................................................................................... 21 3.1 Power and Ground Pins ...................................................................................... 21 3.2 FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 21 3.3 Voltage Identification ......................................................................................... 21 3.4 Catastrophic Thermal Protection .......................................................................... 24 3.5 Signal Terminations and Unused Pins ................................................................... 25 3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 25 3.7 FSB Signal Groups............................................................................................. 25 3.8 CMOS Signals ................................................................................................... 27 3.9 Maximum Ratings.............................................................................................. 27 3.10 Processor DC Specifications ................................................................................ 28 4 Package Mechanical Specifications and Pin Information .......................................... 41 4.1 Package Mechanical Specifications ....................................................................... 41 4.1.1 Package Mechanical Drawings .................................................................. 41 4.1.2 Processor Component Keep-Out Zones...................................................... 46 4.1.3 Package Loading Specifications ................................................................ 46 4.1.4 Processor Mass Specifications .................................................................. 46 4.2 Processor Pinout and Pin List .............................................................................. 47 4.3 Alphabetical Signals Reference ............................................................................ 49 5 Thermal Specifications and Design Considerations .................................................. 79 5.1 Thermal Specifications ....................................................................................... 85 5.1.1 Thermal Diode ....................................................................................... 85 5.1.2 Thermal Diode Offset .............................................................................. 87 5.1.3 Intel® Thermal Monitor........................................................................... 87 5.1.4 Digital Thermal Sensor (DTS)................................................................... 89 5.1.5 Out of Specification Detection .................................................................. 90 |
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