No. 5996-9/13

LC662104A, 662106A, 662108A

Continued from preceding page.

ROM area

Bit

Option specified

Option/data relationship

7

6

5

200FH

4

Reserved. Must be set to predefined values.

This data is generated by the assmbler (00).

3

If the assembler is not used, set this data to (00).

2

1

0

Note: 1. Applies to pins with open-drain output specifications. For pins with other than open-drain output specifications, the ratings in the pin column for that

pin apply.

2. For the oscillator input and output pins, levels up to the free-running oscillation level are allowed.

3. Sink current

4. Source current

5. We recommend the use of reflow soldering techniques to solder mount MFP packages.

Please consult with your Sanyo representative for details on process conditions if the package itself is to be directly immersed in a dip-soldering

bath (dip-soldering techniques).

Parameter

Symbol

Conditions

Ratings

Unit

Note

Maximum supply voltage

–0.3 to +7.0

V

P2, P3 (except for the P33/HOLD pin),

–0.3 to +15.0

V

1

Input voltage

P4, P51, and P53

All other inputs

V

2

Output voltage

P2 and P3 (except for the P33/HOLD pin)

–0.3 to +15.0

V

1

All other inputs

V

2

P0, P1, P2, P3 (except for the P33/HOLD pin),

20

mA

3

Output current per pin

P4, P5

P0, P1, P4, P5

2

mA

4

P2, P3 (except for the P33/HOLD pin)

4

mA

4

Σ I

P1, P2, P3 (except for the P33/HOLD pin)

75

mA

3

Total pin current

Σ I

P0, P4, P5

75

mA

3

Σ I

P1, P2, P3 (except for the P33/HOLD pin)

25

mA

4

Σ I

P0, P4, P5

25

mA

4

Allowable power dissipation

Pd max

Ta = –30 to +70°C: DIP30S (MFP30S)

340 (200)

mW

5

Operating temperature

Topr

–30 to +70

°C

Storage temperature

Tstg

–55 to +125

°C

Specifications