BTA208S-600B

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 3 — 13 April 2011

9 of 13

NXP Semiconductors

BTA208S-600B

3Q Hi-Com Triac

7.

Package outline

Fig 13. Package outline SOT428 (DPAK)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT428

SC-63

TO-252

SOT428

06-02-14

06-03-16

DIMENSIONS (mm are the original dimensions)

Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)

A

2

13

L

e

mounting

base

wA

M

b

E

c

y

0

5

10 mm

scale

UNIT

mm

0.93

0.46

5.46

5.00

0.56

0.20

6.22

5.98

6.73

6.47

10.4

9.6

2.95

2.55

2.38

2.22

1.1

0.9

0.89

0.71

bc

0.9

0.5

Ee

2.285

4.57

4.0

min

4.45

min

0.5

min

Lw

0.2

y

max

0.2

A