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TMP006AIYZFT 데이터시트(PDF) 6 Page - Texas Instruments

부품명 TMP006AIYZFT
상세설명  Infrared Thermopile Sensor in Chip-Scale Package
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Device
ADR0
SCL
V+
A3
C3
C1
A1
SDA
B3
C2
B1
ADR1
A2
AGND
DGND
DRDY
C >0.01
F
m
F
TMP006
SBOS518
– MAY 2011
www.ti.com
OVERVIEW
The TMP006 is a digital temperature sensor that is optimal for thermal management and thermal protection
applications where remote non-contact sensing is desired. The TMP006 is two-wire and SMBus interface
compatible, and is specified over the ambient temperature range of
–40°C to +125°C. The TMP006 measures
object temperatures over a temperature range of
–40°C to +125°C. The TMP006 contains registers for holding
configuration information, temperature measurement results, and sensor voltage measurement. The ambient
temperature measurement and the sensor voltage measurement are used to calculate the object temperature.
Refer to the TMP006 User Guide (SBOU107) for more details.
The SCL and SDA interface pins require pull-up resistors (10 k
Ω, typical) as part of the communication bus, while
DRDY is an open-drain output that must also use a pull-up resistor. DRDY may be shared with other devices if
desired for a wired-OR implementation. A 0.01-
μF power-supply bypass capacitor is recommended, as shown in
Figure 4.
Figure 4. Typical Connection Diagram
The TMP006 provides both local temperature and the thermopile sensor voltage outputs in a WCSP. The local
temperature sensor in the TMP006 is integrated on-chip; the thermal path runs through the WCSP solder balls.
The low thermal resistance of the solder balls provides the thermal path to maintain the chip at the temperature
of the local environment.
The top side of the WCSP must face the object that is being measured with an unobstructed view in order to
accurately measure the temperature. Refer to the user guide TMP006 Layout and Assembly Guidelines
(SBOU108) for more details.
6
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Copyright
© 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP006


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