전자부품 데이터시트 검색엔진 |
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SSL1308M-R21MF-R53 데이터시트(PDF) 4 Page - Superworld Electronics |
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SSL1308M-R21MF-R53 데이터시트(HTML) 4 Page - Superworld Electronics |
4 / 7 page Recovery : 4 to 24hrs of recovery under the standard SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 defects harmful to the characteristics should not Appearance : Cracking, chipping and any other NOTE : Specifications subject to change without notice. Please check our website for latest information. Random Vibration Test be allowed. Humidity Resistance 2. Inductance : Within ± 20% of initial value. No disconnection or short circuit. 1. Appearance : No damage Frequency : 10-55-10Hz for 1 min. A period of 2 hours in each of 3 mutually perpendicular Directions and times : X, Y, Z directions for 2 hours. Amplitude : 1.52mm directions (Total 6 hours). 08.04.2011 Recovery : 4 to 24hrs of recovery under the standard Applied Current : Rated Current condition after the removal from test chamber. Time : 500± 12 hours condition after the removal from test chamber. Humidity : 90% to 95% Temperature : 40± 5° C 2. Inductance : Within ± 20% of initial value. Thermal Shock No disconnection or short circuit. Low Temperature High Temperature Life Test Life Test Reliability Test 1. Appearance : No damage Room Temperature Room Temperature 85± 3 4 Total : 5 cycles 3 2 Within 3 30± 3 Within 3 condition after the removal from test chamber. Temperature (° C) Conditions of 1 cycle. -25± 3 Step 1 Times (min.) 30± 3 Recovery : 4 to 24hrs of recovery under the standard Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Time : 500± 12 hours Temperature : -40± 5° C Time : 500± 12 hours Temperature : 125± 5° C 2. Inductance change : Within ± 20% of initial value Solder Heat Resistance 1. Appearance : No significant abnormality Mechanical Performance Test Saturation Current (Isat) Solderability Test More than 90% of the terminal electrode should be covered with solder. After fluxing, component shall be dipped in a melted Dipping 10± 0.5 seconds Dip Time : 10± 0.5sec. Flux : rosin 60 seconds 150° C 260° C Preheating solder bath at 245± 5° C for 5 secs Solder Temperature : 260± 5° C Solder : Sn-Ag3.0-Cu0.5 Preheat : 150° C, 60sec. Natural cooling Isat(A) will cause Lo to drop approximately 20% cooling 5± 0.5 seconds 245° C 60 seconds 150° C Preheating Natural Dipping HIGH CURRENT POWER INDUCTORS Refer to standard electrical characteristics list Electrical Characteristics Test Heat Rated Current (Irms) 7. RELIABILITY AND TEST CONDITION : Inductance DCR ITEM PERFORMANCE HP4284A Irms(A) will cause the coil temperature rise approximately T=40°C without core loss HIOKI3540 TEST CONDITION SSL1308M SERIES |
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