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AM3874BCYE80 데이터시트(PDF) 5 Page - Texas Instruments |
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AM3874BCYE80 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 345 page AM3874, AM3872, AM3871 www.ti.com SPRS695 – SEPTEMBER 2011 1 High-Performance System-on-Chip (SoC) ......... 1 7.3 Reset .............................................. 175 7.4 Clocking ........................................... 183 1.1 Features .............................................. 1 7.5 Interrupts .......................................... 198 1.2 Applications .......................................... 2 8 Peripheral Information and Timings ............. 201 1.3 Description ........................................... 3 8.1 Parameter Information ............................ 201 1.4 Functional Block Diagram ............................ 4 8.2 Recommended Clock and Control Signal Transition 2 Device Overview ........................................ 6 Behavior ........................................... 202 2.1 Device Comparison .................................. 6 8.3 Controller Area Network Interface (DCAN) ....... 202 8.4 EDMA ............................................. 204 2.2 Device Characteristics ............................... 6 8.5 Emulation Features and Capability ............... 207 2.3 Device Compatibility ................................. 9 8.6 Ethernet MAC Switch (EMAC SW) ................ 211 2.4 ARM ® Cortex™-A8 Microprocessor Unit (MPU) Subsystem Overview ................................ 9 8.7 General-Purpose Input/Output (GPIO) ............ 226 8.8 General-Purpose Memory Controller (GPMC) and 2.5 Media Controller Overview ......................... 11 Error Location Module (ELM) ..................... 229 2.6 SGX530 Overview .................................. 12 8.9 High-Definition Multimedia Interface (HDMI) ...... 246 2.7 Spinlock Module Overview ......................... 12 8.10 High-Definition Video Processing Subsystem (HDVPSS) ......................................... 249 2.8 Mailbox Module Overview .......................... 13 8.11 Inter-Integrated Circuit (I2C) ...................... 255 2.9 Memory Map Summary ............................. 14 8.12 Imaging Subsystem (ISS) ......................... 259 3 Device Pins ............................................. 21 8.13 LPDDR/DDR2/DDR3 Memory Controller ......... 262 3.1 Pin Maps ............................................ 21 8.14 Multichannel Audio Serial Port (McASP) .......... 295 3.2 Terminal Functions ................................. 30 8.15 Multichannel Buffered Serial Port (McBSP) ....... 303 4 Device Configurations .............................. 139 8.16 MultiMedia Card/Secure Digital/Secure Digital Input 4.1 Control Module Registers ......................... 139 Output (MMC/SD/SDIO) ........................... 308 4.2 Boot Modes ....................................... 139 8.17 Peripheral Component Interconnect Express (PCIe) ..................................................... 311 4.3 Pin Multiplexing Control ........................... 146 8.18 Serial ATA Controller (SATA) ..................... 316 4.4 Handling Unused Pins ............................ 156 8.19 Serial Peripheral Interface (SPI) .................. 320 4.5 DeBugging Considerations ........................ 156 8.20 Timers ............................................. 327 5 System Interconnect ................................ 158 8.21 Universal Asynchronous Receiver/Transmitter 6 Device Operating Conditions ...................... 163 (UART) ............................................ 329 6.1 Absolute Maximum Ratings ....................... 163 8.22 Universal Serial Bus (USB2.0) .................... 331 9 Device and Documentation Support ............. 339 6.2 Recommended Operating Conditions ............. 164 9.1 Device Support .................................... 339 6.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating 9.2 Documentation Support ........................... 340 Temperature (Unless Otherwise Noted) .......... 166 9.3 Community Resources ............................ 340 7 Power, Reset, Clocking, and Interrupts ......... 168 10 Mechanical ............................................ 341 7.1 Power, Reset and Clock Management (PRCM) 10.1 Thermal Data for CYE-04 (Top Hat) .............. 341 Module ............................................ 168 10.2 Packaging Information ............................ 341 7.2 Power .............................................. 168 Copyright © 2011, Texas Instruments Incorporated Contents 5 Submit Documentation Feedback Product Folder Link(s): AM3874 AM3872 AM3871 |
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