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IRLZ24L 데이터시트(PDF) 1 Page - Vishay Siliconix

부품명 IRLZ24L
상세설명  Power MOSFET
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제조업체  VISHAY [Vishay Siliconix]
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Document Number: 90416
www.vishay.com
S11-1044-Rev. C, 30-May-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Power MOSFET
IRLZ24S, IRLZ24L, SiHLZ24S, SiHLZ24L
Vishay Siliconix
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Logic-Level Gate Drive
•RDS (on) Specified at VGS = 4 V and 5 V
• 175°C Operating Temperature
•Fast Switching
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
device
design,
low
on-resistance
and
cost-effectiveness.
The D2PAK is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest
power
capability
and
the
lowest
possible
on-resistance in any existing surface mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface mount application.
The through-hole version (IRLZ24L, SiHLZ24L) is available
for low-profile application.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 444 μH, Rg = 25 , IAS = 17 A (see fig. 12).
c. ISD  17 A, dI/dt  140 A/μs, VDD  VDS, TJ  175 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material)
PRODUCT SUMMARY
VDS (V)
60
RDS(on) ()VGS = 5 V
0.10
Qg (Max.) (nC)
18
Qgs (nC)
4.5
Qgd (nC)
12
Configuration
Single
N-Channel MOSFET
G
D
S
D2PAK (TO-263)
G
D
S
I2PAK (TO-262)
G
D
S
ORDERING INFORMATION
Package
D2PAK (TO-263)
I2PAK (TO-262)
Lead (Pb)-free and Halogen-free
SiHLZ24S-GE3
SiHLZ24L-GE3
Lead (Pb)-free
-
IRLZ24LPbF
-
SiHLZ24L-E3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
VDS
60
V
Gate-Source Voltage
VGS
± 10
Continuous Drain Current
VGS at 5 V
TC = 25 °C
ID
17
A
TC = 100 °C
12
Pulsed Drain Currenta
IDM
68
Linear Derating Factor
0.40
W/°C
Linear Derating Factor (PCB Mount)e
0.025
Single Pulse Avalanche Energyb
EAS
110
mJ
Maximum Power Dissipation
TC = 25 °C
PD
60
W
Maximum Power Dissipation (PCB Mount)e
TA = 25 °C
3.7
Peak Diode Recovery dV/dtc
dV/dt
4.5
V/ns
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to + 175
°C
Soldering Recommendations (Peak Temperature)
for 10 s
300d
* Pb containing terminations are not RoHS compliant, exemptions may apply


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