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CSD17313Q2 데이터시트(PDF) 2 Page - Texas Instruments |
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CSD17313Q2 데이터시트(HTML) 2 Page - Texas Instruments |
2 / 9 page CSD17313Q2 SLPS260B – MARCH 2010 – REVISED OCTOBER 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain to Source Voltage VGS = 0V, ID = 250mA 30 V IDSS Drain to Source Leakage VGS = 0V, VDS = 24V 1 mA IGSS Gate to Source Leakage VDS = 0V, VGS = +10 / -8V 100 nA VGS(th) Gate to Source Threshold Voltage VDS = VGS, ID = 250mA 0.9 1.3 1.8 V VGS = 3V, ID = 4A 31 42 m Ω RDS(on) Drain to Source On Resistance VGS = 4.5V, ID = 4A 26 32 m Ω VGS = 8V, ID = 4A 24 30 m Ω gfs Transconductance VDS = 15V, ID = 4A 16 S Dynamic Characteristics Ciss Input Capacitance 260 340 pF VGS = 0V, VDS = 15V, Coss Output Capacitance 140 180 pF f = 1MHz Crss Reverse Transfer Capacitance 13 17 pF RG Series Gate Resistance 1.3 2.6 Ω Qg Gate Charge Total (4.5V) 2.1 2.7 nC Qgd Gate Charge – Gate to Drain 0.4 nC VDS = 15V, ID = 4A Qgs Gate Charge Gate to Source 0.7 nC Qg(th) Gate Charge at Vth 0.3 nC Qoss Output Charge VDS = 13.5V, VGS = 0V 3.8 nC td(on) Turn On Delay Time 2.8 ns tr Rise Time 3.9 ns VDS = 15V, VGS = 4.5V, ID = 4A, RG = 2Ω td(off) Turn Off Delay Time 4.2 ns tf Fall Time 1.3 ns Diode Characteristics VSD Diode Forward Voltage ISD = 4A, VGS = 0V 0.85 1 V Qrr Reverse Recovery Charge 6.4 nC VDD= 13.5V, IF = 4A, di/dt = 300A/ms trr Reverse Recovery Time 12.9 ns THERMAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER MIN TYP MAX UNIT RqJC Thermal Resistance Junction to Case(1) 7.4 °C/W RqJA Thermal Resistance Junction to Ambient(1)(2) 67 °C/W (1) RqJC is determined with the device mounted on a 1-inch 2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RqJC is specified by design, whereas RqJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated |
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