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AD7985 데이터시트(PDF) 9 Page - Analog Devices

부품명 AD7985
상세설명  1 nV/?숰z, Low Power, Rail-to-Rail Output Amplifiers
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ADA4896-2/ADA4897-1
Rev. 0 | Page 9 of 28
ABSOLUTE MAXIMUM RATINGS
The quiescent power is the voltage between the supply pins (VS)
multiplied by the quiescent current (IS).
Table 6.
Parameter
Rating
Supply Voltage
11 V
Power Dissipation
See Figure 3
Common-Mode Input Voltage
−VS − 0.7 V to +VS + 0.7 V
Differential Input Voltage
±0.7 V
Storage Temperature Range
−65°C to +125°C
Operating Temperature Range
−40°C to +125°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
PD = Quiescent Power + (Total Drive Power – Load Power)
()
L
2
OUT
L
OUT
S
S
S
D
R
V
R
V
2
V
I
V
P
⎟⎟
⎜⎜
×
+
×
=
RMS output voltages should be considered. If RL is referenced to
−VS, as in single-supply operation, the total drive power is VS ×
IOUT. If the rms signal levels are indeterminate, consider the
worst case, when VOUT = VS/4 for RL to midsupply.
() (
)
L
S
S
S
D
R
V
I
V
P
2
4
/
+
×
=
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
In single-supply operation with RL referenced to −VS, worst case
is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA.
Also, more metal directly in contact with the package leads and
exposed paddle from metal traces, through holes, ground, and
power planes, reduces θJA.
THERMAL RESISTANCE
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the dual 8-lead LFCSP
(61°C/W), the dual 8-lead MSOP (222°C/W), the single 8-lead
SOIC (133°C/W), and the single 6-lead SOT-23 (306°C/W) on a
JEDEC standard 4-layer board. θJA values are approximations.
θJA is specified for the worst-case conditions, that is, θJA is
specified for a device soldered in a circuit board for surface-
mount packages. Table 7 lists the θJA for the ADA4896-2/
ADA4897-1.
Table 7. Thermal Resistance
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
–45 –35 –25 –15 –5
5
15 25 35 45 55 65 75 85 95 105 115 125
AMBIENT TEMPERAURE (°C)
6-LEAD SOT-23
8-LEAD MSOP
8-LEAD SOIC
8-LEAD LFCSP
TJ = 150°C
Package Type
θJA
Unit
8-Lead Dual MSOP (ADA4896-2)
222
°C/W
8-Lead Dual LFCSP (ADA4896-2)
61
°C/W
8-Lead Single SOIC (ADA4897-1)
133
°C/W
6-Lead Single SOT-23 (ADA4897-1)
306
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the ADA4896-2/
ADA4897-1 is limited by the associated rise in junction
temperature (TJ) on the die. At approximately 150°C, which
is the glass transition temperature, the properties of the plastic
change. Even temporarily exceeding this temperature limit may
change the stresses that the package exerts on the die, perma-
nently shifting the parametric performance of the ADA4896-2/
ADA4897-1. Exceeding a junction temperature of 175°C for an
extended period of time can result in changes in silicon devices,
potentially causing degradation or loss of functionality. The
power dissipated in the package (PD) is the sum of the quiescent
power dissipation and the power dissipated in the die due to the
ADA4896-2/ADA4897-1 drive at the output.
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION


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