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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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AD6657AEBZ 데이터시트(PDF) 11 Page - Analog Devices |
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AD6657AEBZ 데이터시트(HTML) 11 Page - Analog Devices |
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11 / 36 page  Data Sheet AD6657A Rev. 0 | Page 11 of 36 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating AVDD to AGND −0.3 V to +2.0 V DRVDD to AGND −0.3 V to +2.0 V VIN+x, VIN−x to AGND −0.3 V to AVDD + 0.2 V CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V SYNC to AGND −0.3 V to AVDD + 0.2 V VCMx to AGND −0.3 V to AVDD + 0.2 V CSB to AGND −0.3 V to DRVDD + 0.2 V SCLK to AGND −0.3 V to DRVDD + 0.2 V SDIO to AGND −0.3 V to DRVDD + 0.2 V PDWN to AGND −0.3 V to DRVDD + 0.2 V MODE to AGND −0.3 V to DRVDD + 0.2 V Digital Outputs to AGND −0.3 V to DRVDD + 0.2 V DCO+AB, DCO−AB, DCO+CD, DCO−CD to AGND −0.3 V to DRVDD + 0.2 V Operating Temperature Range (Ambient) −40°C to +85°C Maximum Junction Temperature Under Bias 150°C Storage Temperature Range (Ambient) −65°C to +150°C THERMAL CHARACTERISTICS The values in Table 7 are per JEDEC JESD51-7 and JEDEC JESD25-5 for a 2S2P test board. Typical θJA is specified for a 4-layer printed circuit board (PCB) with a solid ground plane. As shown in Table 7, airflow improves heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces θJA. Table 7. Package Type Airflow Velocity θJA1 θJC2 θJB3 Unit 144-Ball CSP_BGA 0 m/s 26.9 8.9 6.6 °C/W 1 m/s 24.2 °C/W 2.5 m/s 23.0 °C/W 1 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 2 Per MIL-STD 883, Method 1012.1. 3 Per JEDEC JESD51-8 (still air). The values in Table 8 are from simulations. The PCB is a JEDEC multilayer board. Thermal performance for actual applications requires careful inspection of the conditions in the application to determine whether they are similar to those assumed in these calculations. Table 8. Package Type Airflow Velocity JB JT Unit 144-Ball CSP_BGA 0 m/s 14.4 0.23 °C/W 1 m/s 14.0 0.50 °C/W 2.5 m/s 13.9 0.53 °C/W ESD CAUTION Stresses abovethose listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum ratingconditionsfor extended periodsmay affect device reliability. |
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