TS12011/TS12012

Touchstone Semiconductor, Inc.

Page 11

630 Alder Drive, Milpitas, CA 95035

TS12011_12DS r1p0

+1 (408) 215 - 1220

▪ www.touchstonesemi.com

RTFDS

PACKAGE OUTLINE DRAWING

Information furnished by Touchstone Semiconductor is believed to be accurate and reliable. However, Touchstone Semiconductor does not

assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all

information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.

Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance

notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone

Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,

customers should provide adequate design and operating safeguards. Trademarks and registered trademarks are the property of their

respective owners.

0.200

BOTTOM VIEW

2.000

2.000

TOP VIEW

10L STSLP

(2x2mm)

Pin 1 DOT BY

MARKING

PIN #1

IDENTIFICATION

0.152 Ref

A

0.000-0.050

NOTE!

· All dimensions in mm.

· This part is compliant with JEDEC MO-229 spec

A

MAX.

NOM.

MIN.

0.600

0.550

0.500

SIDE VIEW

0.900

Exp.DAP

1.400±0.050

Exp.DAP

0.300

0.400 Bsc

10-Pin TDFN22 Package Outline Drawing

(N.B., Drawings are not to scale)